Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules

Ortiz Gonzalez, J.; Aliyu, Attahir Murtala; Alatise, O.; Castellazzi, Alberto; Ran, L.; Mawby, P.

Abstract

SiC is a wide bandgap semiconductor with better electrothermal properties than silicon, including higher temperature of operation, higher breakdown voltage, lower losses and the ability to switch at higher frequencies. However, the power cycling performance of SiC devices in traditional silicon packaging systems is in need of further investigation since initial studies have shown reduced reliability. These traditional packaging systems have been developed for silicon, a semiconductor with different electrothermal and thermomechanical properties from SiC, hence the stresses on the different components of the package will change. Pressure packages, a packaging alternative where the weak elements of the traditional systems like wirebonds are removed, have demonstrated enhanced reliability for silicon devices however, there has not been much investigation on the performance of SiC devices in press-pack assemblies. This will be important for high power applications where reliability is critical. In this paper, SiC Schottky diodes in pressure packages have been evaluated, including the electrothermal characterisation for different clamping forces and contact materials, the thermal impedance evaluation and initial thermal cycling studies, focusing on the use of aluminium graphite as contact material.

Citation

Ortiz Gonzalez, J., Aliyu, A. M., Alatise, O., Castellazzi, A., Ran, L., & Mawby, P. (2016). Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules. Microelectronics Reliability, 64, 434-439. https://doi.org/10.1016/j.microrel.2016.07.062

• Journal Article Type: Article
• Acceptance Date: Jul 8, 2016
• Publication Date: Sep 18, 2016
• Deposit Date: Jun 29, 2017
• Publicly Available Date: Jun 29, 2017
• Journal: Microelectronics Reliability
• Print ISSN: 0026-2714
• Electronic ISSN: 0026-2714
• Publisher: Elsevier
• Peer Reviewed: Peer Reviewed
• Volume: 64
• Pages: 434-439
• DOI: https://doi.org/10.1016/j.microrel.2016.07.062
• Keywords: SiC, Aluminium graphite, Pressure packaging
• Public URL: https://nottingham-repository.worktribe.com/output/817253
• Publisher URL: https://doi.org/10.1016/j.microrel.2016.07.062
• Additional Information: This article is maintained by: Elsevier; Article Title: Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules; Journal Title: Microelectronics Reliability; CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.microrel.2016.07.062; Content Type: article; Copyright: © 2017 The Authors. Published by Elsevier Ltd.
• Contract Date: Jun 29, 2017