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Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability

Cova, P.; Delmonte, N.; Solomon, A.K.; Castellazzi, Alberto

Authors

P. Cova

N. Delmonte

A.K. Solomon

Alberto Castellazzi



Abstract

An alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes is presented. This flat switch, which is designed for high-frequency application with high power density, exhibits high strength, high toughness, low parasitic inductance and high thermal conductivity. Such a novel assembly approach is suitable to optimize performance, reliability and availability of the power system in which it is used. The paper focuses on the thermal performance of this assembly at normal and extreme operating conditions, studied by means of FEM thermo-fluidynamic simulations of the module integrated with connectors and liquid cooler, and thermal measurement performed on an early prototype. Improved solutions are also investigated by the FE model.

Journal Article Type Article
Publication Date Sep 30, 2016
Journal Microelectronics Reliability
Print ISSN 0026-2714
Electronic ISSN 0026-2714
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 64
APA6 Citation Cova, P., Delmonte, N., Solomon, A., & Castellazzi, A. (2016). Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability. Microelectronics Reliability, 64, doi:10.1016/j.microrel.2016.07.019
DOI https://doi.org/10.1016/j.microrel.2016.07.019
Keywords High power density, Packaging, System integration, Inverter,
Thermal design
Publisher URL http://www.sciencedirect.com/science/article/pii/S0026271416301652
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0





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