Inkjet printing of polyimide insulators for the 3D printing of dielectric materials for microelectronic applications

Zhang, Fan; Tuck, Christopher; Hague, Richard J.M.; He, Yinfeng; Saleh, Ehab; Li, You; Sturgess, Craig; Wildman, Ricky D.

Abstract

In this article, we report the first continuous fabrication of inkjet-printed polyimide films, which were used as insulating layers for the production of capacitors. The polyimide ink was prepared from its precursor poly(amic) acid, and directly printed on to a hot substrate (at around 160 °C) to initialize a rapid thermal imidization. By carefully adjusting the substrate temperature, droplet spacing, droplet velocity, and other printing parameters, polyimide films with good surface morphologies were printed between two conducting layers to fabricate capacitors. In this work, the highest capacitance value, 2.82 ± 0.64 nF, was achieved by capacitors (10 mm × 10 mm) with polyimide insulating layers thinner than 1 μm, suggesting that the polyimide inkjet printing approach is an efficient way for producing dielectric components of microelectronic devices. © 2016 The Authors Journal of Applied Polymer Science Published by Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016, 133, 43361.

Citation

Zhang, F., Tuck, C., Hague, R. J., He, Y., Saleh, E., Li, Y., …Wildman, R. D. (2016). Inkjet printing of polyimide insulators for the 3D printing of dielectric materials for microelectronic applications. Journal of Applied Polymer Science, https://doi.org/10.1002/APP.43361

• Journal Article Type: Article
• Publication Date: Jan 29, 2016
• Deposit Date: Feb 2, 2016
• Publicly Available Date: Feb 2, 2016
• Journal: Journal of Applied Polymer Science
• Print ISSN: 0021-8995
• Electronic ISSN: 1097-4628
• Publisher: Wiley
• Peer Reviewed: Peer Reviewed
• Issue: 43361
• DOI: https://doi.org/10.1002/APP.43361
• Keywords: dielectric properties, manufacturing, polyimides, rheology
• Public URL: https://nottingham-repository.worktribe.com/output/771423
• Publisher URL: http://onlinelibrary.wiley.com/doi/10.1002/app.43361/full