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Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”

Li, Jianfeng; Agyakwa, Pearl A.; Johnson, C. Mark

Authors

Jianfeng Li

Pearl A. Agyakwa

C. Mark Johnson



Abstract

Comments have recently been made by Yuan et al. [1] to deny one statement in our paper [2], Eq. (21) in Wagner's paper [3] can be used to accurately calculate the integrated interdiffusion coefficient for an incremental diffusion couple only under the assumption of constant Molar volume for all phases. We respond here to explain how they misunderstood our mathematical deduction, made a mistake in deriving a couple of equations, falsely cited our work and employed unjustifiable assumption. As a result, we believe that their comments are invalid to deny our statement.

Citation

Li, J., Agyakwa, P. A., & Johnson, C. M. (2016). Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”. Intermetallics, 69, https://doi.org/10.1016/j.intermet.2015.10.016

Journal Article Type Article
Acceptance Date Oct 22, 2015
Online Publication Date Oct 31, 2015
Publication Date Feb 1, 2016
Deposit Date Jul 19, 2016
Publicly Available Date Jul 19, 2016
Journal Intermetallics
Print ISSN 0966-9795
Electronic ISSN 0966-9795
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 69
DOI https://doi.org/10.1016/j.intermet.2015.10.016
Keywords Intermetallics; miscellaneous; diffusion; phase interfaces
Public URL http://eprints.nottingham.ac.uk/id/eprint/33385
Publisher URL http://dx.doi.org/10.1016/j.intermet.2015.10.016
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0





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