L. Yang
Calibration of a novel microstructural damage model for wire bonds
Yang, L.; Agyakwa, P.A.; Johnson, C.M.
Authors
PEARL AGYAKWA PEARL.AGYAKWA@NOTTINGHAM.AC.UK
Anne Mclaren Research Fellow
MARK JOHNSON MARK.JOHNSON@NOTTINGHAM.AC.UK
Professor of Advanced Power Conversion
Abstract
In a previous paper, a new time-domain damage-based physics model was proposed for the lifetime prediction of wire bond interconnects in power electronic modules. Unlike cycle-dependent life prediction methodologies, this model innovatively incorporates temperature- and time-dependent properties so that rate-sensitive processes associated with the bond degradation can be accurately represented. This paper presents the work on the development and calibration of the damage model by linking its core parameter, i.e., “damage,” to the strain energy density, which is a physically quantifiable materials property. Isothermal uniaxial tensile data for unbonded pure aluminum wires (99.999%) have been used to develop constitutive functions, and the model has been calibrated by the derived values of the strain energy density.
Citation
Yang, L., Agyakwa, P., & Johnson, C. (2014). Calibration of a novel microstructural damage model for wire bonds. IEEE Transactions on Device and Materials Reliability, 14(4), 989-994. https://doi.org/10.1109/TDMR.2014.2354739
Journal Article Type | Article |
---|---|
Acceptance Date | Aug 30, 2014 |
Online Publication Date | Sep 4, 2014 |
Publication Date | Dec 2, 2014 |
Deposit Date | Sep 6, 2016 |
Publicly Available Date | Sep 6, 2016 |
Journal | IEEE Transactions on Device and Materials Reliability |
Print ISSN | 1530-4388 |
Electronic ISSN | 1558-2574 |
Publisher | Institute of Electrical and Electronics Engineers |
Peer Reviewed | Peer Reviewed |
Volume | 14 |
Issue | 4 |
Pages | 989-994 |
DOI | https://doi.org/10.1109/TDMR.2014.2354739 |
Public URL | https://nottingham-repository.worktribe.com/output/741774 |
Publisher URL | http://ieeexplore.ieee.org/document/6891277/?arnumber=6891277 |
Contract Date | Sep 6, 2016 |
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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0
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