Calibration of a novel microstructural damage model for wire bonds
Yang, L.; Agyakwa, P.A.; Johnson, C.M.
P.A. Agyakwa firstname.lastname@example.org
In a previous paper, a new time-domain damage-based physics model was proposed for the lifetime prediction of wire bond interconnects in power electronic modules. Unlike cycle-dependent life prediction methodologies, this model innovatively incorporates temperature- and time-dependent properties so that rate-sensitive processes associated with the bond degradation can be accurately represented. This paper presents the work on the development and calibration of the damage model by linking its core parameter, i.e., “damage,” to the strain energy density, which is a physically quantifiable materials property. Isothermal uniaxial tensile data for unbonded pure aluminum wires (99.999%) have been used to develop constitutive functions, and the model has been calibrated by the derived values of the strain energy density.
|Journal Article Type||Article|
|Publication Date||Dec 2, 2014|
|Journal||IEEE Transactions on Device and Materials Reliability|
|Publisher||Institute of Electrical and Electronics Engineers|
|Peer Reviewed||Peer Reviewed|
|APA6 Citation||Yang, L., Agyakwa, P., & Johnson, C. (2014). Calibration of a novel microstructural damage model for wire bonds. IEEE Transactions on Device and Materials Reliability, 14(4), doi:10.1109/TDMR.2014.2354739|
|Copyright Statement||Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0|
Calibration of novel microstructural damage model for wire bonds.pdf
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0
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