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Comparative Evaluation of High Power Solid State Power Controller (SSPC) With and Without Auxiliary Over-current Bypass Circuit

Adhikari, Jeevan; Yang, Tao; Bozhko, Serhiy; Wheeler, Patrick

Comparative Evaluation of High Power Solid State Power Controller (SSPC) With and Without Auxiliary Over-current Bypass Circuit Thumbnail


Authors

Jeevan Adhikari

TAO YANG TAO.YANG@NOTTINGHAM.AC.UK
Professor of Aerospace Electricalsystems



Abstract

This paper explores the possibility of a semiconductor-based over-current bypass circuit for high current solid-state power controllers (SSPCs). Therefore, two different topologies of the bidirectional DC SSPCs: a. without over-current bypass circuit b. with an over-current bypass circuit are presented for the same power ratings. The first SSPC consists of a parallel matrix connection of the discrete MOSFET devices (conducts during nominal and over-current conditions) and the second one is designed with fewer MOSFET loops (conducts during nominal condition) and additional IGBT modules matrices to bypass the over-current. The thermal performances of both the SSPCs are evaluated analytically and compared during the nominal and over-current situations. Later, the PLECS simulation models of the SSPCs are developed and the junction temperature of the devices are estimated. The overall weight, power density, and cost of these two SSPCs are approximated for the comparison. It is found that the SSPC topology with bypass circuit exhibits better power density and lower cost. Therefore, it can be employed to replace the tradition circuit breakers for the more electric aircraft (MEA) in the near future.

Citation

Adhikari, J., Yang, T., Bozhko, S., & Wheeler, P. (2019, October). Comparative Evaluation of High Power Solid State Power Controller (SSPC) With and Without Auxiliary Over-current Bypass Circuit. Presented at IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society, Lisbon, Portugal

Presentation Conference Type Edited Proceedings
Conference Name IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society
Start Date Oct 14, 2019
End Date Oct 17, 2019
Acceptance Date Jul 4, 2020
Online Publication Date Dec 9, 2019
Publication Date 2019-10
Deposit Date Jan 27, 2021
Publicly Available Date Jan 27, 2021
Pages 2628-2633
Series ISSN 2577-1647
Book Title Proceedings: IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society
ISBN 978-1-7281-4879-3
DOI https://doi.org/10.1109/IECON.2019.8926717
Keywords MOSFET, Junctions, Insulated gate bipolar transistors, Circuit breakers, Aircraft, Thermal resistance
Public URL https://nottingham-repository.worktribe.com/output/5271824
Publisher URL https://ieeexplore.ieee.org/document/8926717
Additional Information © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

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