Parametric study of design parameters and thermal comfort in primary schools in Ho Chi Minh City, Vietnam

Le, Thi Ho Vi; Gillott, Mark; Rodrigues, Lucelia

Abstract

Overheating of premises is a typical thermal discomfort issue in naturally ventilated primary schools in Ho Chi Minh City, Vietnam. Several design parameters were shown to affect the indoor thermal environment. A parametric study was conducted and based on several building performance simulations to investigate the influences of the individual design parameters on indoor air temperatures and the prevalence of overheating in primary schools. The sensitivity analysis indicated that the material of building envelopes, the openings, and the solar controls, in descending order, affected overheating occurrence. The findings could assist the architect in choosing which parameters should be prioritised in the design stage, which is particularly useful in renovation and retrofit projects.

Citation

Le, T. H. V., Gillott, M., & Rodrigues, L. Parametric study of design parameters and thermal comfort in primary schools in Ho Chi Minh City, Vietnam. Presented at XII International Scientific and Practical Forum “Environmentally Sustainable Cities and Settlements: Problems and Solutions” (ESCP-2023), Hanoi Capital, Vietnam

• Presentation Conference Type: Conference Paper (published)
• Conference Name: XII International Scientific and Practical Forum “Environmentally Sustainable Cities and Settlements: Problems and Solutions” (ESCP-2023)
• Acceptance Date: Jun 26, 2023
• Online Publication Date: Jul 25, 2023
• Publication Date: Jul 25, 2023
• Deposit Date: Oct 25, 2023
• Publicly Available Date: Oct 25, 2023
• Journal: E3S Web of Conferences
• Electronic ISSN: 2267-1242
• Publisher: EDP Sciences
• Peer Reviewed: Peer Reviewed
• Volume: 403
• Article Number: 04007
• DOI: https://doi.org/10.1051/e3sconf/202340304007
• Keywords: Pulmonary and Respiratory Medicine; Pediatrics, Perinatology, and Child Health
• Public URL: https://nottingham-repository.worktribe.com/output/25394081
• Publisher URL: https://www.e3s-conferences.org/articles/e3sconf/abs/2023/40/e3sconf_escp2023_04007/e3sconf_escp2023_04007.html