Co-design/simulation of flip-chip assembly for high voltage IGBT packages
(2017)
Presentation / Conference Contribution
Rajaguru, P., Bailey, C., Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., …Elliot, A. (2017). Co-design/simulation of flip-chip assembly for high voltage IGBT packages.
This paper details a co-design and modelling methodology to optimise the flip-chip assembly parameters so that the overall package and system meets performance and reliability specifications for LED lighting applications. A co-design methodology is e... Read More about Co-design/simulation of flip-chip assembly for high voltage IGBT packages.