All Outputs (2)

Assessing the Impact of Twisting and Bending Deformations on Flexible Interconnect Performance (2022)
Journal Article
Altinozen, E., Vukovic, A., & Sewell, P. (2022). Assessing the Impact of Twisting and Bending Deformations on Flexible Interconnect Performance. IEEE journal on flexible electronics, https://doi.org/10.1109/jflex.2022.3232470

Flexible interconnects are essential components for signal transmission for foldable and wearable electronics. As such they are exposed to a variety of mechanical deformations that can degrade their electromagnetic performance. This paper analyses th... Read More about Assessing the Impact of Twisting and Bending Deformations on Flexible Interconnect Performance.

Two-Dimensional Thermal Diffusion Equation Solver Based on Unstructured Transmission-Line Modelling and Optimal Delaunay Triangular Meshes (2022)
Journal Article
Yan, K., Vukovic, A., Sewell, P., & Benson, T. M. (2022). Two-Dimensional Thermal Diffusion Equation Solver Based on Unstructured Transmission-Line Modelling and Optimal Delaunay Triangular Meshes. IEEE Journal on Multiscale and Multiphysics Computational Techniques, https://doi.org/10.1109/JMMCT.2022.3209071

The transmission-line modelling (TLM) method has been widely applied to many areas including electromagnetic and heat conduction problems. Its unstructured version, unstructured TLM (UTLM), however, has not hitherto been fully exploited in thermal di... Read More about Two-Dimensional Thermal Diffusion Equation Solver Based on Unstructured Transmission-Line Modelling and Optimal Delaunay Triangular Meshes.