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Assessing the Impact of Twisting and Bending Deformations on Flexible Interconnect Performance

Altinozen, Ekrem; Vukovic, Ana; Sewell, Phillip

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Authors

Ekrem Altinozen

ANA VUKOVIC ANA.VUKOVIC@NOTTINGHAM.AC.UK
Professor of Electromagnetic Applications

PHIL SEWELL phillip.sewell@nottingham.ac.uk
Professor of Electromagnetics



Abstract

Flexible interconnects are essential components for signal transmission for foldable and wearable electronics. As such they are exposed to a variety of mechanical deformations that can degrade their electromagnetic performance. This paper analyses the impact of bending and twisting deformations on the transmission properties of a variety of commercially available polymer and elastomer based interconnects and compares to the performance of flat interconnects fabricated on rigid substrates. The analysis of the impact of deformations also takes into account the degradation in the conductivity of the printed lines due to reported mechanical deformations.

Journal Article Type Article
Acceptance Date Dec 26, 2022
Online Publication Date Dec 26, 2022
Publication Date 2022
Deposit Date Jan 4, 2023
Publicly Available Date Jan 4, 2023
Journal IEEE Journal on Flexible Electronics
Print ISSN 2768-167X
Electronic ISSN 2768-167X
Publisher Institute of Electrical and Electronics Engineers (IEEE)
Peer Reviewed Peer Reviewed
DOI https://doi.org/10.1109/jflex.2022.3232470
Public URL https://nottingham-repository.worktribe.com/output/15436504
Publisher URL https://ieeexplore.ieee.org/document/9999417

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