All Outputs (5)

Self-assembled titanium-based macrostructures with hierarchical (macro-, micro-, and nano) porosities: A fundamental study (2024)
Journal Article
Wadge, M. D., Agyakwa, P. A., Felfel, R. M., Homer, R., Cooper, T. P., Kudrynskyi, Z. R., …Grant, D. M. (2024). Self-assembled titanium-based macrostructures with hierarchical (macro-, micro-, and nano) porosities: A fundamental study. Materials and Design, 240, Article 112835. https://doi.org/10.1016/j.matdes.2024.112835

This study details the novel self-assembly of sodium titanate converted Ti-based microspheres into hierarchical porous 3D constructs, with macro-, micro-, and nanoporosity, for the first time. Ti6Al4V microspheres were suspended into 5 M NaOH (60 °C/... Read More about Self-assembled titanium-based macrostructures with hierarchical (macro-, micro-, and nano) porosities: A fundamental study.

Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process (2021)
Journal Article
Dai, J., Li, J., Agyakwa, P., Corfield, M., & Johnson, C. M. (2021). Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process. IEEE Transactions on Device and Materials Reliability, 21(4), 536-543. https://doi.org/10.1109/TDMR.2021.3118323

This study investigates the power cycling reliability of nanosilver sintered joints formed by a time-reduced sintering process, designed for use on a die bonder. A range of sintering parameters, reflecting different levels of manufacturability, were... Read More about Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process.

Time-efficient sintering processes to attach power devices using nanosilver dry film (2017)
Presentation / Conference Contribution
Dai, J., Li, J., Agyakwa, P., & Mark Johnson, C. (2017). Time-efficient sintering processes to attach power devices using nanosilver dry film. Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), 2017(HiTEN), 000207–000212. https://doi.org/10.4071/2380-4491.2017.hiten.207

Pressure-assisted sintering processes to attach power devices using wet nanosilver pastes with time scales of minutes to a few hours have been widely reported. This paper presents our work on time-efficient sintering, using nanosilver dry film and an... Read More about Time-efficient sintering processes to attach power devices using nanosilver dry film.

Calibration of a novel microstructural damage model for wire bonds (2014)
Journal Article
Yang, L., Agyakwa, P., & Johnson, C. (2014). Calibration of a novel microstructural damage model for wire bonds. IEEE Transactions on Device and Materials Reliability, 14(4), 989-994. https://doi.org/10.1109/TDMR.2014.2354739

In a previous paper, a new time-domain damage-based physics model was proposed for the lifetime prediction of wire bond interconnects in power electronic modules. Unlike cycle-dependent life prediction methodologies, this model innovatively incorpora... Read More about Calibration of a novel microstructural damage model for wire bonds.

Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module (2010)
Presentation / Conference Contribution
Mattey, N., Skuriat, R., Li, J., Agyakwa, P., Evans, P., & Mark Johnson, C. (2010, September). Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module. Presented at 3rd Electronics System Integration Technology Conference ESTC, Berlin, Germany

We discuss the mechanical and thermal design of a high temperature pressure-mounted base-plate-less power module for application in a continuous high temperature (150°C) ambient. The thermal resistance of potential thermal interface materials (TIMs)... Read More about Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module.