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Calibration of a novel microstructural damage model for wire bonds

Yang, L.; Agyakwa, P.A.; Johnson, C.M.

Authors

L. Yang

C.M. Johnson



Abstract

In a previous paper, a new time-domain damage-based physics model was proposed for the lifetime prediction of wire bond interconnects in power electronic modules. Unlike cycle-dependent life prediction methodologies, this model innovatively incorporates temperature- and time-dependent properties so that rate-sensitive processes associated with the bond degradation can be accurately represented. This paper presents the work on the development and calibration of the damage model by linking its core parameter, i.e., “damage,” to the strain energy density, which is a physically quantifiable materials property. Isothermal uniaxial tensile data for unbonded pure aluminum wires (99.999%) have been used to develop constitutive functions, and the model has been calibrated by the derived values of the strain energy density.

Journal Article Type Article
Publication Date Dec 2, 2014
Journal IEEE Transactions on Device and Materials Reliability
Print ISSN 1530-4388
Electronic ISSN 1530-4388
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 14
Issue 4
APA6 Citation Yang, L., Agyakwa, P., & Johnson, C. (2014). Calibration of a novel microstructural damage model for wire bonds. IEEE Transactions on Device and Materials Reliability, 14(4), https://doi.org/10.1109/TDMR.2014.2354739
DOI https://doi.org/10.1109/TDMR.2014.2354739
Publisher URL http://ieeexplore.ieee.org/document/6891277/?arnumber=6891277
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0





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