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Calibration of a novel microstructural damage model for wire bonds

Yang, L.; Agyakwa, P.A.; Johnson, C.M.

Authors

L. Yang

MARK JOHNSON mark.johnson@nottingham.ac.uk
Professor of Advanced Power Conversion



Abstract

In a previous paper, a new time-domain damage-based physics model was proposed for the lifetime prediction of wire bond interconnects in power electronic modules. Unlike cycle-dependent life prediction methodologies, this model innovatively incorporates temperature- and time-dependent properties so that rate-sensitive processes associated with the bond degradation can be accurately represented. This paper presents the work on the development and calibration of the damage model by linking its core parameter, i.e., “damage,” to the strain energy density, which is a physically quantifiable materials property. Isothermal uniaxial tensile data for unbonded pure aluminum wires (99.999%) have been used to develop constitutive functions, and the model has been calibrated by the derived values of the strain energy density.

Citation

Yang, L., Agyakwa, P., & Johnson, C. (2014). Calibration of a novel microstructural damage model for wire bonds. IEEE Transactions on Device and Materials Reliability, 14(4), 989-994. https://doi.org/10.1109/TDMR.2014.2354739

Journal Article Type Article
Acceptance Date Aug 30, 2014
Online Publication Date Sep 4, 2014
Publication Date Dec 2, 2014
Deposit Date Sep 6, 2016
Publicly Available Date Sep 6, 2016
Journal IEEE Transactions on Device and Materials Reliability
Print ISSN 1530-4388
Electronic ISSN 1558-2574
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 14
Issue 4
Pages 989-994
DOI https://doi.org/10.1109/TDMR.2014.2354739
Public URL http://eprints.nottingham.ac.uk/id/eprint/36305
Publisher URL http://ieeexplore.ieee.org/document/6891277/?arnumber=6891277
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0





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