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A thermal cycling reliability study of ultrasonically bonded copper wires

Arjmand, Elaheh; Agyakwa, Pearl A.; Corfield, Martin R.; Li, Jianfeng; Mouawad, Bassem; Mark Johnson, C.

Authors

Elaheh Arjmand

Pearl A. Agyakwa

Martin R. Corfield

Jianfeng Li

Bassem Mouawad

C. Mark Johnson



Abstract

In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed no discernible degradation or wear out from initial conditions to 2900 passive thermal cycles from − 55 to 125 °C. Instead, an apparent increase in shear strength is observed as the number of thermal cycles increases. Nanoindentation hardness investigations suggest the occurrence of cyclic hardening. Microstructural investigations of the interfacial morphologies before and after cycling and after shear testing are also presented and discussed.

Citation

Arjmand, E., Agyakwa, P. A., Corfield, M. R., Li, J., Mouawad, B., & Mark Johnson, C. (2016). A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability, 59, https://doi.org/10.1016/j.microrel.2016.01.009

Journal Article Type Article
Acceptance Date Jan 16, 2016
Online Publication Date Jan 25, 2016
Publication Date Apr 1, 2016
Deposit Date Oct 3, 2016
Publicly Available Date Mar 29, 2024
Journal Microelectronics Reliability
Print ISSN 0026-2714
Electronic ISSN 0026-2714
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 59
DOI https://doi.org/10.1016/j.microrel.2016.01.009
Keywords Heavy copper wire bonding; Reliability; Power electronics; Passive thermal cycling; Hardness
Public URL https://nottingham-repository.worktribe.com/output/977208
Publisher URL http://www.sciencedirect.com/science/article/pii/S0026271416300099

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