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Time-efficient sintering processes to attach power devices using nanosilver dry film

Dai, Jingru; Li, Jianfeng; Agyakwa, Pearl; Johnson, Christopher Mark

Authors

Jingru Dai

Jianfeng Li

Pearl Agyakwa

Christopher Mark Johnson



Abstract

Pressure-assisted sintering processes to attach power devices using wet nanosilver pastes with time scales of minutes to a few hours have been widely reported. This paper presents our work on time-efficient sintering, using nanosilver dry film and an automatic die pick and place machine, resulting in process times of just a few seconds. The combined parameters of sintering temperature 250 °C, sintering pressure 10 MPa and sintering time 5 s were selected as the benchmark process to attach 2 mm × 2 mm × 0.5 mm dummy Si devices. Then the effects of either the sintering temperature (240 to 300 °C), time (1 to 9 s) or pressure (6 to 25 MPa) on the porosity and shear strength of the sintered joints were investigated with 3 groups and a total of 13 experimental trials. The average porosities of 24.6 to 46.2% and shear strengths of 26.1 to 47.7 MPa are comparable with and/or even better than those reported for sintered joints using wet nanosilver pastes. Their dependences on the sintering temperature, time and pressure are further fitted to equations similar to those describing the kinetics of sintering processes of powder compacts. The equations obtained can be used to not only reveal different mechanisms dominating the densification and bonding strength, but also anticipate the thermal-induced evolutions of microstructures of these rapidly sintered joints during future reliability tests and/or in service.

Journal Article Type Article
Publication Date Oct 31, 2017
Journal Journal of Microelectronics and Electronic Packaging
Electronic ISSN 1551-4897
Peer Reviewed Peer Reviewed
Volume 14
Issue 4
APA6 Citation Dai, J., Li, J., Agyakwa, P., & Johnson, C. M. (2017). Time-efficient sintering processes to attach power devices using nanosilver dry film. Journal of Microelectronics and Electronic Packaging, 14(4), doi:10.4071/imaps.521776
DOI https://doi.org/10.4071/imaps.521776
Keywords Sintered die attachment, efficient manufacturing, nanosilver film, porosity, shear strength, statistical analysis, data fitting
Publisher URL http://imapsource.org/doi/10.4071/imaps.521776
Copyright Statement Copyright information regarding this work can be found at the following address: http://eprints.nottingh.../end_user_agreement.pdf

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://eprints.nottingham.ac.uk/end_user_agreement.pdf





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