Sintered-silver bonding of high-temperature piezoelectric ceramic sensors

Billore, Justine; Hasco�t, Stanislas; Robutel, R�mi; Buttay, Cyril; Li, Jianfeng

Abstract

Silver sintering is used to bond five components together, in order to form a piezoelectric sensor. A description is provided of the preparation of these components, and of the manufacturing steps, which are carried out at a low temperature (280 °C).


The resulting sensor assemblies are then characterized: cross-sectional views show that the silver layer has a very dense struc-ture, with less than 1 % porosity, although further focused-ion beam investigations show that this porosity is closer to 15 %. The shear strength is approximately 30 MPa. The Young's modulus of the silver bondline is measured using nanoindentation, and is found to be comparable with that of bulk silver (56.6 GPa). Finally, a silver-sintered sensor is compared with a sensor bonded using conventional techniques, showing that an improvement in sensitivity by a factor of more than 3 is achieved.

Citation

Billore, J., Hascoët, S., Robutel, R., Buttay, C., & Li, J. (2017). Sintered-silver bonding of high-temperature piezoelectric ceramic sensors. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7(1), 3-9. https://doi.org/10.1109/TCPMT.2016.2628874

• Journal Article Type: Article
• Acceptance Date: Oct 29, 2016
• Online Publication Date: Dec 16, 2016
• Publication Date: Jan 31, 2017
• Deposit Date: Jul 14, 2017
• Publicly Available Date: Jul 14, 2017
• Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology
• Electronic ISSN: 2156-3985
• Publisher: Institute of Electrical and Electronics Engineers
• Peer Reviewed: Peer Reviewed
• Volume: 7
• Issue: 1
• Pages: 3-9
• DOI: https://doi.org/10.1109/TCPMT.2016.2628874
• Keywords: Silver, Temperature sensors, Vibrations, Bonding, Ceramics
• Public URL: https://nottingham-repository.worktribe.com/output/838141
• Publisher URL: http://ieeexplore.ieee.org/document/7786896/
• Additional Information: c2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
• Contract Date: Jul 14, 2017