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Data Links Modelling under Radiated EMI and its Impact on Sampling Errors in the Physical Layer

Pena-Quintal, A. E.; Basford, M. J.; Niewiadomski, K.; Greedy, S.; Sumner, M.; Thomas, D. W. P.

Authors

ANGEL PENA QUINTAL Angel.PenaQuintal2@nottingham.ac.uk
Marie Sklodowska-Curie Early Stageresearcher

M. J. Basford

KAROL NIEWIADOMSKI KAROL.NIEWIADOMSKI@NOTTINGHAM.AC.UK
Marie Sklodowska-Curie Early Stage Researcher

MARK SUMNER mark.sumner@nottingham.ac.uk
Professor of Electrical Energy Systems

DAVID THOMAS dave.thomas@nottingham.ac.uk
Professor of Electromagnetics Applications



Abstract

This paper deals with the effects of radiated EMI on serial communication links using software modelling with particular emphasis on the physical layer. The effect of EMI in data links is an important problem to solve in many harsh environments such as the automotive and the transport sector as well as communications, in fact the EMI effect is able to produce sampling errors in digital/binary operations. Currently binding standards prefer the analysis in frequency domain to account for EMI impact, however when dealing with data links, time domain analysis might report useful information, therefore a link between those two is needed. The cable models are developed using SACAMOS modelling software, taking into consideration the frequency parameters. The model can be used on almost any SPICE simulator to analyse the effect of EMI. The simulations performed in this research are verified on a real laboratory experiment in order to demonstrate the capabilities of SACAMOS.

Citation

Pena-Quintal, A. E., Basford, M. J., Niewiadomski, K., Greedy, S., Sumner, M., & Thomas, D. W. P. (2020). Data Links Modelling under Radiated EMI and its Impact on Sampling Errors in the Physical Layer. In Proceedings of 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE. https://doi.org/10.1109/emceurope48519.2020.9245670

Conference Name 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE
Conference Location Rome, Italy
Start Date Sep 23, 2020
End Date Sep 25, 2020
Acceptance Date Apr 20, 2020
Online Publication Date Nov 6, 2020
Publication Date Sep 23, 2020
Deposit Date Apr 7, 2021
Publicly Available Date Apr 7, 2021
Series Title IEEE International Symposium on Electromagnetic Compatibility - EMC Europe
Series ISSN 2325-0364
Book Title Proceedings of 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE
ISBN 9781728155791
DOI https://doi.org/10.1109/emceurope48519.2020.9245670
Public URL https://nottingham-repository.worktribe.com/output/5434985
Publisher URL https://ieeexplore.ieee.org/abstract/document/9245670
Additional Information © 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

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