Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module

DiMarino, Christina; Mouawad, Bassem; Johnson, C. Mark; Wang, Meiyu; Tan, Yan-Song; Lu, Guo-Quan; Boroyevich, Dushan; Burgos, Rolando

Abstract

Wide bandgap (WBG) power devices with voltage ratings exceeding 10 kV have the potential to revolutionize medium-and high-voltage systems due to their high-speed switching and lower ON-state losses. However, the present power module packages are limiting the performance of these unique switches. The objective of this article is to push the boundaries of high-density, high-speed, 10-kV power module packaging. The proposed package addresses the well-known electromagnetic and thermal challenges, as well as the more recent and prominent electrostatic and electromagnetic interference (EMI) issues associated with high-speed, 10-kV devices. The module achieves low and balanced parasitic inductances, resulting in a record switching speed of 250 V/ns with negligible ringing and voltage overshoot. An integrated screen reduces the common-mode (CM) current that is generated by these fast voltage transients by ten times. This screen connection simultaneously increases the partial discharge inception voltage (PDIV) by more than 50%. A compact, medium-voltage termination and system interface design is also proposed in this article. With the integrated jet-impingement cooler, the power module prototype achieves a power density of 4 W/mm3. This article presents the design, prototyping, and testing of this optimized package for 10-kV SiC MOSFETs.

Citation

DiMarino, C., Mouawad, B., Johnson, C. M., Wang, M., Tan, Y., Lu, G., …Burgos, R. (2020). Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module. IEEE Journal of Emerging and Selected Topics in Power Electronics, 8(1), 381-394. https://doi.org/10.1109/jestpe.2019.2944138

• Journal Article Type: Article
• Acceptance Date: Sep 10, 2019
• Online Publication Date: Sep 27, 2019
• Publication Date: 2020-03
• Deposit Date: May 13, 2020
• Publicly Available Date: May 13, 2020
• Journal: IEEE Journal of Emerging and Selected Topics in Power Electronics
• Print ISSN: 2168-6777
• Electronic ISSN: 2168-6785
• Publisher: Institute of Electrical and Electronics Engineers
• Peer Reviewed: Peer Reviewed
• Volume: 8
• Issue: 1
• Pages: 381-394
• DOI: https://doi.org/10.1109/jestpe.2019.2944138
• Public URL: https://nottingham-repository.worktribe.com/output/3918776
• Publisher URL: https://ieeexplore.ieee.org/document/8851182
• Additional Information: © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.