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Retrograde p-well for 10-kv class sic igbts

Tiwari, Amit K.; Antoniou, Marina; Lophitis, Neophytos; Perkin, Samuel; Trajkovic, Tatjana; Udrea, Florin

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Authors

Amit K. Tiwari

Marina Antoniou

Samuel Perkin

Tatjana Trajkovic

Florin Udrea



Abstract

In this paper, we propose the use of a retrograde doping profile for the p-well for ultrahigh voltage (>10 kV) SiC IGBTs. We show that the retrograde p-well effectively addresses the punchthrough issue, whereas offering a robust control over the gate threshold voltage. Both the punchthrough elimination and the gate threshold voltage control are crucial to high-voltage vertical IGBT architectures and are determined by the limits on the doping concentration and the depth that a conventional p-well implant can have. Without any punchthrough, a 10-kV SiC IGBT consisting of retrograde p-well yields gate threshold voltages in the range of 6-7 V with a gate oxide thickness of 100 nm. Gate oxide thickness is typically restricted to 50-60 nm in SiC IGBTs if a conventional p-well with 1×10 17 cm -3 is utilized. We further show that the optimized retrograde p-well offers the most optimum switching performance. We propose that such an effective retrograde p-well, which requires low-energy shallow implants and thus key to minimize processing challenges and device development cost, is highly promising for the ultrahigh-voltage (>10 kV) SiC IGBT technology.

Journal Article Type Article
Acceptance Date May 16, 2019
Online Publication Date Jun 3, 2019
Publication Date Jul 1, 2019
Deposit Date Apr 24, 2020
Publicly Available Date Apr 24, 2020
Journal IEEE Transactions on Electron Devices
Print ISSN 0018-9383
Electronic ISSN 1557-9646
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 66
Issue 7
Pages 3066-3072
DOI https://doi.org/10.1109/TED.2019.2918008
Public URL https://nottingham-repository.worktribe.com/output/3706485
Publisher URL https://ieeexplore.ieee.org/document/8728169
Additional Information © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

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