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Gallium-Based Liquid Metal Substrate Integrated Waveguide Switches

Alkaraki, Shaker; Kelly, James; Borja, Alejandro L.; Mittra, Raj; Wang, Yi

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Authors

James Kelly

Alejandro L. Borja

Raj Mittra

Yi Wang



Abstract

This letter presents a new approach for reconfiguring substrate integrated waveguide (SIW) devices. It involves allowing or prohibiting the wave propagation by using a removable wall which is built from a series of drill holes. When the wall is required, the holes are filled with gallium-based liquid metal (LM), thus forming vias. When the wall is no longer required, the holes are emptied of LM. The method has been applied to a single-pole single-throw (SPST) SIW switch as well as a single-pole double-throw (SPDT) switch. Both switches perform well over a wide frequency bandwidth, approaching one octave. The SPST switch performs well from 2.4 to 4.3 GHz. In the ON-state (i.e., wall removed), the insertion loss (IL) is ≤0.5 dB. In the OFF-state (i.e., wall inserted), the isolation is 30 dB. The SPDT switch operates effectively from 4.7 to 7.2 GHz. The IL, between two connected ports, is 0.7 dB. The isolation between unconnected ports is 40 dB. The proposed approach will be applicable within a wide range of different reconfigurable microwave devices.

Citation

Alkaraki, S., Kelly, J., Borja, A. L., Mittra, R., & Wang, Y. (2021). Gallium-Based Liquid Metal Substrate Integrated Waveguide Switches. IEEE Microwave and Wireless Components Letters, 31(3), 257-260. https://doi.org/10.1109/LMWC.2020.3040795

Journal Article Type Letter
Acceptance Date Nov 22, 2020
Online Publication Date Dec 9, 2020
Publication Date 2021-03
Deposit Date Aug 22, 2023
Publicly Available Date Aug 24, 2023
Journal IEEE Microwave and Wireless Components Letters
Print ISSN 1531-1309
Electronic ISSN 1558-1764
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 31
Issue 3
Pages 257-260
DOI https://doi.org/10.1109/LMWC.2020.3040795
Public URL https://nottingham-repository.worktribe.com/output/24576960
Publisher URL https://ieeexplore.ieee.org/document/9288887

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