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On monitoring chip formation, penetration depth and cutting malfunctions in bone micro-drilling via acoustic emission

Liao, Zhirong; Axinte, Dragos A.


Professor of Manufacturing Engineering


Micro-drilling of bone is increasing demanded in many kinds of surgery operations recently. One of the mainly challenges in this procedure is to control the drilling process and avoid the surrounding tissue damage. Monitoring the cutting condition is expected to be a promising way for safety enhancement and application of automated solution for robot surgery. However, there is still no efficient method to meet this issue. The present paper reports on the possibility of using AE sensory measure for monitoring bone cutting process and support the understanding of the cutting phenomena on this unique material. For this purpose, the main frequency band of AE signal in bone micro-drilling was studied. Chip formation analysis was carried out to capture the relationship between AE signal and the chip morphology in bone micro-drilling process. A wavelet based approach was proposed to detect the penetration position of the micro drill and cutting malfunctions in micro-drilling process combined with the fractal analysis. The experimental results with micro-drilling of bovine rib bone showed good evidence that the proposed AE sensory measures have a great potential to be used in efficient and easily implementable solutions for monitoring the bone micro-drilling process.


Liao, Z., & Axinte, D. A. (2016). On monitoring chip formation, penetration depth and cutting malfunctions in bone micro-drilling via acoustic emission. Journal of Materials Processing Technology, 229, 82-93.

Journal Article Type Article
Acceptance Date Sep 6, 2015
Online Publication Date Sep 9, 2015
Publication Date Mar 1, 2016
Deposit Date Nov 27, 2018
Journal Journal of Materials Processing Technology
Print ISSN 0924-0136
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 229
Pages 82-93
Keywords Modelling and Simulation; Industrial and Manufacturing Engineering; Metals and Alloys; Ceramics and Composites; Computer Science Applications
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