Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module

Mattey, Nevil; Skuriat, Robert; Li, Jianfeng; Agyakwa, Pearl; Evans, Paul; Mark Johnson, C

doi:10.1109/estc.2010.5642909

All Outputs (1)

Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module (2010)
Presentation / Conference Contribution
Mattey, N., Skuriat, R., Li, J., Agyakwa, P., Evans, P., & Mark Johnson, C. (2010, September). Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module. Presented at 3rd Electronics System Integration Technology Conference ESTC, Berlin, Germany

We discuss the mechanical and thermal design of a high temperature pressure-mounted base-plate-less power module for application in a continuous high temperature (150°C) ambient. The thermal resistance of potential thermal interface materials (TIMs)... Read More about Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module.