Laser drilling of via micro-holes in single-crystal semiconductor substrates using a 1070nm fibre laser with millisecond pulse widths
(2015)
Presentation / Conference Contribution
Maclean, J. O., Hodson, J. R., & Voisey, K. T. (2015, March). Laser drilling of via micro-holes in single-crystal semiconductor substrates using a 1070nm fibre laser with millisecond pulse widths. Presented at Industrial Laser Applications Symposium 2015, Kenilworth, United Kingdom
© 2015 SPIE. Micro-machining of semiconductors is relevant to fabrication challenges within the semiconductor industry. For via holes for solar cells, laser drilling potentially avoids deep plasma etching which requires sophisticated equipment and co... Read More about Laser drilling of via micro-holes in single-crystal semiconductor substrates using a 1070nm fibre laser with millisecond pulse widths.