Novel silicon carbide integrated power module for EV application

Mouawad, Bassem; Espina, Jordi; Li, Jianfeng; Empringham, Lee; Johnson, C. Mark

Abstract

The successful penetration of Electric Vehicles (EVs) into the global automotive markets requires the developments of cost effective, high performance and high integration power electronic systems. The present work is concerned with the structural integration of power electronic converters to meet targets for increased power density, improved electrical performance and reduced cost without compromising thermal performance or reliability for EV applications. In particular, a SiC power module to integrate multiple functional elements, i.e. semiconductor devices, DC-link capacitors, output filters, current sensing, and gate driver within a single enclosure sharing a common cooling circuit has been designed and fabricated. Electrical test results showed very smooth waveforms of the outputs, verifying the high frequency switching capacity of the fabricated power module.

Citation

Mouawad, B., Espina, J., Li, J., Empringham, L., & Johnson, C. M. (2018, May). Novel silicon carbide integrated power module for EV application. Presented at WiPDA 2018 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia

• Conference Name: WiPDA 2018 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
• Start Date: May 17, 2018
• End Date: May 19, 2018
• Acceptance Date: Jan 30, 2018
• Online Publication Date: May 1, 2018
• Publication Date: May 17, 2018
• Deposit Date: Aug 1, 2018
• Publicly Available Date: Aug 3, 2018
• Book Title: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia 2018), At Xi'an, Shaanxi
• Chapter Number: NA
• ISBN: NA
• Keywords: Integrated Power Module; Power Electronics; half-bridge; SiC devices, output filter, Power Electronic Packaging, direct cooling
• Public URL: https://nottingham-repository.worktribe.com/output/896244
• Related Public URLs: http://www.wipda-asia.org/index.html
• Contract Date: Aug 1, 2018