On the suitability of high vacuum electrospray deposition for the fabrication of molecular electronic devices

Temperton, Robert H.; O'Shea, James N.; Scurr, David J.

Abstract

© 2017 We present a series of three studies investigating the potential application of high vacuum electrospray deposition to construct molecular electronic devices. Through the use of time of flight secondary ion mass spectrometry we explore the use of this novel deposition technique to fabricating multilayer structures using materials that are compatible with the same solvents and films containing a mixture of molecules from orthogonal solvents. Using X-ray photoelectron spectroscopy we study the deposition of a polymer blend using electrospray and find evidence of preferential deposition of one of the components.

Citation

Temperton, R. H., O'Shea, J. N., & Scurr, D. J. (2017). On the suitability of high vacuum electrospray deposition for the fabrication of molecular electronic devices. Chemical Physics Letters, 682, 15-19. https://doi.org/10.1016/j.cplett.2017.05.068

• Journal Article Type: Article
• Acceptance Date: May 25, 2017
• Online Publication Date: May 29, 2017
• Publication Date: May 29, 2017
• Deposit Date: Jun 2, 2017
• Publicly Available Date: Jun 2, 2017
• Journal: Chemical Physics Letters
• Print ISSN: 0009-2614
• Electronic ISSN: 0009-2614
• Publisher: Elsevier
• Peer Reviewed: Peer Reviewed
• Volume: 682
• Pages: 15-19
• DOI: https://doi.org/10.1016/j.cplett.2017.05.068
• Keywords: Electrospray Deposition; ToF-SIMS; XPS; Molecular Electronics; Polymers
• Public URL: https://nottingham-repository.worktribe.com/output/877861
• Publisher URL: http://www.sciencedirect.com/science/article/pii/S0009261417305249
• Additional Information: This article is maintained by: Elsevier; Article Title: On the suitability of high vacuum electrospray deposition for the fabrication of molecular electronic devices; Journal Title: Chemical Physics Letters; CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.cplett.2017.05.068; Content Type: article; Copyright: © 2017 Elsevier B.V. All rights reserved.
• Contract Date: Jun 2, 2017