Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process

Dai, Jingru; Li, Jianfeng; Agyakwa, Pearl; Corfield, Martin; Johnson, Christopher Mark

Abstract

This study investigates a time-reduced sintering process for die attachment, prepared, within a processing time of several seconds using dry nanosilver film. The effects of three main sintering parameters, sintering temperature (220 to 300 °C), sintering time (1 to 9 s) and bonding pressure (6 to 25 MPa) on the resultant shear strength are investigated using uniform design and single factor experimental trials. The shear strength data series for each of the experimental trials was statistically analyzed to indicate any deviation from normal distribution. The resulting shear strength values were regressed or fitted, and further analyzed by polynomial and kinetic-like equations to estimate the relationship between the shear strength and sintering parameters. The regression analysis for shear strength may not only be used for explaining mass transportation mechanisms, but also for identifying the proposed manufacturability of the time-reduced sintering process.

Citation

Dai, J., Li, J., Agyakwa, P., Corfield, M., & Johnson, C. M. (2020). Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process. Microelectronics Reliability, 111, Article 113740. https://doi.org/10.1016/j.microrel.2020.113740

• Journal Article Type: Article
• Acceptance Date: Jun 30, 2020
• Online Publication Date: Jul 16, 2020
• Publication Date: Aug 1, 2020
• Deposit Date: Jul 14, 2020
• Publicly Available Date: Jul 17, 2021
• Journal: Microelectronics Reliability
• Print ISSN: 0026-2714
• Electronic ISSN: 0026-2714
• Publisher: Elsevier
• Peer Reviewed: Peer Reviewed
• Volume: 111
• Article Number: 113740
• DOI: https://doi.org/10.1016/j.microrel.2020.113740
• Keywords: Electrical and Electronic Engineering; Atomic and Molecular Physics, and Optics; Electronic, Optical and Magnetic Materials; Surfaces, Coatings and Films; Safety, Risk, Reliability and Quality; Condensed Matter Physics
• Public URL: https://nottingham-repository.worktribe.com/output/4766899
• Publisher URL: https://www.sciencedirect.com/science/article/pii/S0026271420302237
• Additional Information: This article is maintained by: Elsevier; Article Title: Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process; Journal Title: Microelectronics Reliability; CrossRef DOI link to publisher maintained version: https://doi.org/10.1016/j.microrel.2020.113740; Content Type: article; Copyright: © 2020 Published by Elsevier Ltd.