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Performance Improvement of >10kV SiC IGBTs with Retrograde p-Well

Tiwari, Amit K.; Antoniou, Marina; Lophitis, Neo; Perkins, Samuel; Trajkovic, Tanya; Trajkovic, Tatjana; Udrea, Florin

Authors

Amit K. Tiwari

Marina Antoniou

Neo Lophitis

Samuel Perkins

Tanya Trajkovic

Tatjana Trajkovic

Florin Udrea



Contributors

Peter M. Gammon
Editor

Vishal A. Shah
Editor

Richard A. McMahon
Editor

Michael R. Jennings
Editor

Oliver Vavasour
Editor

Philip A. Mawby
Editor

Faye Padfield
Editor

Abstract

A p-well consisting of a retrograde doping profile is investigated for performance improvement of >10kV SiC IGBTs. The retrograde p-well, which can be realized using low-energy shallow implants, effectively addresses the punch-through, a common issue in high-voltage vertical architectures consisting of a conventional p-well with typical doping density of 1e17cm-3 and depth 1µm. The innovative approach offers an extended control over the threshold voltage. Without any punch-through, a threshold voltage in the range 6V-7V is achieved with gate-oxide thickness of 100nm. Gate oxide thickness is typically restricted to 50nm if a conventional p-well with doping density of 1e17cm-3 is utilized. We therefore propose a highly promising solution, the retrograde p-well, for the development of >10kV SiC IGBTs.

Citation

Tiwari, A. K., Antoniou, M., Lophitis, N., Perkins, S., Trajkovic, T., Trajkovic, T., & Udrea, F. (2018, September). Performance Improvement of >10kV SiC IGBTs with Retrograde p-Well. Presented at 12th European Conference on Silicon Carbide and Related Materials (ECSCRM 2018), Birmingham, UK

Presentation Conference Type Edited Proceedings
Conference Name 12th European Conference on Silicon Carbide and Related Materials (ECSCRM 2018)
Start Date Sep 2, 2018
End Date Sep 6, 2018
Acceptance Date May 25, 2018
Publication Date Jul 31, 2019
Deposit Date May 5, 2020
Publisher Trans Tech Publications
Volume 963
Pages 639-642
Series Title Materials Science Forum
Series ISSN 1662-9752
Book Title Proceedings of 12th European Conference on Silicon Carbide and Related Materials (ECSCRM 2018)
ISBN 9783035713329
DOI https://doi.org/10.4028/www.scientific.net/MSF.963.639
Keywords Breakdown Voltage, High-voltage SiC IGBT, Ion-implantation, Punch-through, Retrograde p-well, Threshold voltage control
Public URL https://nottingham-repository.worktribe.com/output/4238127
Publisher URL https://www.scientific.net/MSF.963.639


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