Unstructured Transmission Line Modelling (TLM) Method for Modelling of Advanced Photonic Structures

Vukovic, A.; Sewell, P.; Dimitrijevic, T.; Lang, B.; Rihani, S.; Boylan, K.; Berry, G.; Hattasan, N.; Moodie, D.; Rawsthorne, J.; Robertson, M.

Abstract

This paper overviews the most recent advances in the unstructured Transmission Line Modelling method that is uniquely placed for modeling advanced photonic applications with multi-scale features. The paper focuses on the holistic approach that needs to be taken when considering these applications which involves not just the electromagnetic solver, but also important aspects of the unstructured mesh generation and geometry definition. The capability of the UTLM is demonstrated on the complex geometry of a photonic polarization splitter that incorporates diverse components namely tapers, multimoded waveguides and a photonic crystal region.

Citation

Vukovic, A., Sewell, P., Dimitrijevic, T., Lang, B., Rihani, S., Boylan, K., Berry, G., Hattasan, N., Moodie, D., Rawsthorne, J., & Robertson, M. (2023, October). Unstructured Transmission Line Modelling (TLM) Method for Modelling of Advanced Photonic Structures. Presented at 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS 2023)), Niš , Serbia

• Presentation Conference Type: Conference Paper (published)
• Conference Name: 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS 2023))
• Start Date: Oct 25, 2023
• End Date: Oct 27, 2023
• Acceptance Date: Aug 1, 2023
• Online Publication Date: Nov 16, 2023
• Publication Date: Oct 25, 2023
• Deposit Date: Jan 8, 2024
• Publicly Available Date: May 15, 2024
• Publisher: Institute of Electrical and Electronics Engineers
• Book Title: 2023 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS)
• ISBN: 979-8-3503-4703-6
• DOI: https://doi.org/10.1109/telsiks57806.2023.10316055
• Public URL: https://nottingham-repository.worktribe.com/output/27855377
• Publisher URL: https://ieeexplore.ieee.org/document/10316055