Selection of materials for IGBT modules to achieve stable short circuit failure behaviour
Presentation / Conference Contribution
Li, J., Yaqub, I., & Johnson, C. M. Selection of materials for IGBT modules to achieve stable short circuit failure behaviour. Presented at PCIM Asia 2016
IGBT modules which can fail to stable short circuit mode have great allocations in electricity network related fields. Sn3.5Ag solder joint and sintered Ag joint for the die attachment and Mo, Cu, Sn3.5Ag, Al and Ag foils for the top side insert mate... Read More about Selection of materials for IGBT modules to achieve stable short circuit failure behaviour.