All Outputs (73)

Developing power semiconductor device model for virtual prototyping of power electronics systems (2016)
Conference Proceeding
Li, K., Evans, P., & Johnson, C. M. (2016). Developing power semiconductor device model for virtual prototyping of power electronics systems.

Virtual prototyping (VP) is very important for power electronics systems design. A virtual prototyping design tool based on different modelling technology and model order reduction is proposed in the paper. In order to combine circuit electromagnetic... Read More about Developing power semiconductor device model for virtual prototyping of power electronics systems.

GaN-HEMT dynamic ON-state resistance characterisation and modelling (2016)
Conference Proceeding
Li, K., Evans, P., & Johnson, C. M. (2016). GaN-HEMT dynamic ON-state resistance characterisation and modelling.

GaN-HEMTs suffer from trapping effects which might increase device ON-state resistance (RDS(on)) values. Thus, dynamic RDS(on) of a commercial GaN-HEMT is characterized at different bias voltages in the paper by a proposed measurement circuit. Based... Read More about GaN-HEMT dynamic ON-state resistance characterisation and modelling.

Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30K (2016)
Journal Article
Agyakwa, P., Yang, L., Arjmand, E., Evans, P., Corfield, M., & Johnson, C. M. (2016). Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30K. Journal of Electronic Materials, 45, 3659-3672. https://doi.org/10.1007/s11664-016-4519-0

© 2016, The Author(s). Ultrasonically bonded heavy Al wires subjected to a small junction temperature fluctuation under power cycling from 40°C to 70°C were investigated using a non-destructive three-dimensional (3-D) x-ray tomography evaluation appr... Read More about Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30K.

Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator (2016)
Journal Article
Arjmand, E., Agyakwa, P., Corfield, M., Li, J., & Johnson, C. M. (2016). Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 6(5), 814-821. https://doi.org/10.1109/TCPMT.2016.2543001

Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algor... Read More about Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator.

Integrated motor drives: state of the art and future trends (2016)
Journal Article
Abebe, R., Vakil, G., Lo Calzo, G., Cox, T., Lambert, S., Johnson, C. M., …Mecrow, B. (2016). Integrated motor drives: state of the art and future trends. IET Electric Power Applications, 10(8), 757-771. https://doi.org/10.1049/iet-epa.2015.0506

With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter an... Read More about Integrated motor drives: state of the art and future trends.

Hybrid HVDC circuit breaker with self-powered gate drives (2016)
Journal Article
Effah, F. B., Watson, A. J., Ji, C., Amankwah, E. K., Johnson, C. M., Davidson, C., & Clare, J. C. (2016). Hybrid HVDC circuit breaker with self-powered gate drives. IET Power Electronics, 9(2), 228-236. https://doi.org/10.1049/iet-pel.2015.0531

The ever increasing electric power demand and the advent of renewable energy sources have revived the interest in high-voltage direct current (HVDC) multi-terminal networks. However, the absence of a suitable circuit breaker or fault tolerant VSC st... Read More about Hybrid HVDC circuit breaker with self-powered gate drives.

Low inductance 2.5kV packaging technology for SiC switches (2016)
Conference Proceeding
Mouawad, B., Li, J., Castellazzi, A., Johnson, C. M., Erlbacher, T., & Friedriches, P. (2016). Low inductance 2.5kV packaging technology for SiC switches.

The switching speed of power semiconductors has reached levels where conventional semiconductors packages limit the achievable performance due to relatively high parasitic inductance and capacitance. This paper presents a novel packaging structure wh... Read More about Low inductance 2.5kV packaging technology for SiC switches.

Real-time deterministic power flow control through dispatch of distributed energy resources (2015)
Journal Article
Fazeli, A., Sumner, M., Johnson, C. M., & Christopher, E. (2015). Real-time deterministic power flow control through dispatch of distributed energy resources. IET Generation, Transmission and Distribution, 9(16), https://doi.org/10.1049/iet-gtd.2015.0182

Integration of intermittent renewable resources and mass electrification of heat and transport into the existing electricity network, with limited network asset reinforcement requires incorporation of intelligence in form of active management of flex... Read More about Real-time deterministic power flow control through dispatch of distributed energy resources.

Dependence of overcurrent failure modes of IGBT modules on interconnect technologies (2015)
Journal Article
Yaqub, I., Li, J., & Johnson, C. M. (2015). Dependence of overcurrent failure modes of IGBT modules on interconnect technologies. Microelectronics Reliability, 55(12), 2596-2605. https://doi.org/10.1016/j.microrel.2015.09.020

Insulated gate bipolar transistor (IGBT) modules which can fail to short circuit mode have great of applications in electricity network related fields. Single IGBT samples have been constructed with the standard Al wire bonding, flexible printed circ... Read More about Dependence of overcurrent failure modes of IGBT modules on interconnect technologies.

Design Tools for Rapid Multidomain Virtual Prototyping of Power Electronic Systems (2015)
Journal Article
Evans, P. L., Castellazzi, A., & Johnson, C. M. (2016). Design Tools for Rapid Multidomain Virtual Prototyping of Power Electronic Systems. IEEE Transactions on Power Electronics, 31(3), 2443-2455. https://doi.org/10.1109/TPEL.2015.2437793

The need for multidisciplinary virtual prototyping in power electronics has been well established, however, design tools capable of facilitating a rapid iterative virtual design process do not exist. A key challenge in developing such tools is identi... Read More about Design Tools for Rapid Multidomain Virtual Prototyping of Power Electronic Systems.

Application of Kalman Filter to Estimate Junction Temperature in IGBT Power Modules (2015)
Journal Article
Eleffendi, M. A., & Johnson, C. M. (2016). Application of Kalman Filter to Estimate Junction Temperature in IGBT Power Modules. IEEE Transactions on Power Electronics, 31(2), 1576-1587. https://doi.org/10.1109/TPEL.2015.2418711

Knowledge of instantaneous junction temperature is essential for effective health management of power converters, enabling safe operation of the power semiconductors under all operating conditions. Methods based on fixed thermal models are typically... Read More about Application of Kalman Filter to Estimate Junction Temperature in IGBT Power Modules.

A novel stochastic modelling approach for electric vehicle charging power and energy requirements (2015)
Conference Proceeding
Fazeli, A., Johnson, C. M., Sumner, M., & Christopher, E. (2015). A novel stochastic modelling approach for electric vehicle charging power and energy requirements.

Electrification of heat and transport in addition to integration of intermittent renewable resources into the existing electricity network is expected to occur in near future. Such a transformation is expected to force the operation of the electricit... Read More about A novel stochastic modelling approach for electric vehicle charging power and energy requirements.

Investigating the impact of varying the number of distributed energy resources on controlling the power flow within a microgrid (2015)
Conference Proceeding
Fazeli, A., Sumner, M., Johnson, C. M., & Christopher, E. (2015). Investigating the impact of varying the number of distributed energy resources on controlling the power flow within a microgrid.

The electrification of heat and transport in addition to integration of intermittent renewable resources into the existing electricity network is expected to occur in near future. Such a transformation is expected to force the operation of the electr... Read More about Investigating the impact of varying the number of distributed energy resources on controlling the power flow within a microgrid.

Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment (2014)
Journal Article
Wang, Y., Li, J., Agyakwa, P., Johnson, C. M., & Li, S. (2014). Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment. Molecular Crystals and Liquid Crystals, 604(1), 11-26. https://doi.org/10.1080/15421406.2014.967647

© 2014 Copyright © Taylor & Francis Group, LLC. The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanoparticles at 240°C and 5 MPa for 3 to 17 minutes. Their microstructural features were quantitatively cha... Read More about Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment.

Power flow control for power and voltage management in future smart energy communities (2014)
Conference Proceeding
Fazeli, A., Sumner, M., Christopher, E., & Johnson, C. M. (2014). Power flow control for power and voltage management in future smart energy communities.

The Community Power Flow Control (CPFC) Algorithm has been proposed as a technique for managing electrical power and energy within small communities. The CPFC manages the resources in the community (DSM, energy storage, RES) in order to control the c... Read More about Power flow control for power and voltage management in future smart energy communities.

Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics (2014)
Journal Article
Mussallam, M., Yin, C., Bailey, C., & Johnson, C. M. (2015). Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics. IEEE Transactions on Power Electronics, 30(5), 2601-2613. https://doi.org/10.1109/TPEL.2014.2358555

Power electronics are efficient for conversion and conditioning of the electrical energy through a wide range of applications. Proper life consumption estimation methods applied for power electronics that can operate in real time under in-service mis... Read More about Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics.

Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects (2014)
Journal Article
Li, J., Castellazzi, A., Dai, T., Corfield, M., Solomon, A. K., & Johnson, C. M. (2015). Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects. IEEE Transactions on Power Electronics, 30(5), https://doi.org/10.1109/TPEL.2014.2357334

A stacked substrate–chip–bump–chip–substrate assembly has been demonstrated in the construction of power switch modules with high power density and good electrical performance. In this paper, special effort has been devoted to material selection and... Read More about Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects.

Calibration of a novel microstructural damage model for wire bonds (2014)
Journal Article
Yang, L., Agyakwa, P., & Johnson, C. (2014). Calibration of a novel microstructural damage model for wire bonds. IEEE Transactions on Device and Materials Reliability, 14(4), 989-994. https://doi.org/10.1109/TDMR.2014.2354739

In a previous paper, a new time-domain damage-based physics model was proposed for the lifetime prediction of wire bond interconnects in power electronic modules. Unlike cycle-dependent life prediction methodologies, this model innovatively incorpora... Read More about Calibration of a novel microstructural damage model for wire bonds.

Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods (2014)
Journal Article
Arjmand, E., Agyakwa, P. A., & Johnson, C. M. (2014). Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods. Microelectronics Reliability, 54(9-10), https://doi.org/10.1016/j.microrel.2014.07.119

The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples were prepared with 25 different designs with 5 different bonding parameters such as time, ultrasonic power, begin- force, end-force and touch-down step... Read More about Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods.

Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles (2014)
Journal Article
Li, J., Johnson, C. M., Buttay, C., Sabbah, W., & Azzopardi, S. (2015). Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. Journal of Materials Processing Technology, 215, 299-308. https://doi.org/10.1016/j.jmatprotec.2014.08.002

3 mm × 3 mm dummy SiC dies with 100\200\200 nm thick Ti\W\Au metallization have simultaneously been attached using sintering of Ag nanoparticle paste on AlN-based direct bonded copper substrates with 5\0.1 μm thick NiP\Au finish. The effect of prepar... Read More about Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles.