Reactive material jetting of polyimide insulators for complex circuit board design
(2018)
Journal Article
Zhang, F., Saleh, E., Vaithilingam, J., Li, Y., Tuck, C., Hague, R., …He, Y. (2019). Reactive material jetting of polyimide insulators for complex circuit board design. Additive Manufacturing, 25, 477-484. https://doi.org/10.1016/j.addma.2018.11.017
Polyimides are a group of high performance thermal stable dielectric materials used in diverse applications. In this article, we synthesized and developed a high-performance polyimide precursor ink for a Material Jetting (MJ) process. The proposed in... Read More about Reactive material jetting of polyimide insulators for complex circuit board design.