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Reactive material jetting of polyimide insulators for complex circuit board design (2018)
Journal Article
Zhang, F., Saleh, E., Vaithilingam, J., Li, Y., Tuck, C., Hague, R., …He, Y. (2019). Reactive material jetting of polyimide insulators for complex circuit board design. Additive Manufacturing, 25, 477-484. https://doi.org/10.1016/j.addma.2018.11.017

Polyimides are a group of high performance thermal stable dielectric materials used in diverse applications. In this article, we synthesized and developed a high-performance polyimide precursor ink for a Material Jetting (MJ) process. The proposed in... Read More about Reactive material jetting of polyimide insulators for complex circuit board design.

Author Correction: Additive manufacture of complex 3D Au-containing nanocomposites by simultaneous two-photon polymerisation and photoreduction (2018)
Journal Article
Hu, Q., Sun, X., Parmenter, C. D. J., Fay, M. W., Smith, E. F., Rance, G. A., …Wildman, R. (2018). Author Correction: Additive manufacture of complex 3D Au-containing nanocomposites by simultaneous two-photon polymerisation and photoreduction. Scientific Reports, 8(1), Article 3512. https://doi.org/10.1038/s41598-018-21513-8

A correction to this article has been published and is linked from the HTML and PDF versions of this paper. The error has not been fixed in the paper.