Sintered-silver bonding of high-temperature piezoelectric ceramic sensors
(2016)
Journal Article
Billore, J., Hascoët, S., Robutel, R., Buttay, C., & Li, J. (2017). Sintered-silver bonding of high-temperature piezoelectric ceramic sensors. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7(1), 3-9. https://doi.org/10.1109/TCPMT.2016.2628874
Silver sintering is used to bond five components together, in order to form a piezoelectric sensor. A description is provided of the preparation of these components, and of the manufacturing steps, which are carried out at a low temperature (280 °C).... Read More about Sintered-silver bonding of high-temperature piezoelectric ceramic sensors.