All Outputs (2)

Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module (2010)
Presentation / Conference Contribution
Mattey, N., Skuriat, R., Li, J., Agyakwa, P., Evans, P., & Mark Johnson, C. (2010, September). Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module. Presented at 3rd Electronics System Integration Technology Conference ESTC, Berlin, Germany

We discuss the mechanical and thermal design of a high temperature pressure-mounted base-plate-less power module for application in a continuous high temperature (150°C) ambient. The thermal resistance of potential thermal interface materials (TIMs)... Read More about Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module.

Fast extraction of dynamic thermal impedance for multi-chip power modules (2010)
Presentation / Conference Contribution
Evans, P., & Johnson, C. M. (2010, March). Fast extraction of dynamic thermal impedance for multi-chip power modules. Presented at 2010 6th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany

A novel method for the extraction of the dynamic thermal impedance models of multi-chip power modules is presented. The method described is a fast, accurate approach based on the GMRES algorithm that extracts dynamic thermal impedance expressions wit... Read More about Fast extraction of dynamic thermal impedance for multi-chip power modules.