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Development and Validation of a Smart Architecture for Thyristor Valves (2023)
Journal Article
Sala, G., De Bonis, G., Costabeber, A., Tani, A., Johnson, C. M., & Clare, J. C. (2023). Development and Validation of a Smart Architecture for Thyristor Valves. IEEE Journal of Emerging and Selected Topics in Power Electronics, 11(4), 4068-4076. https://doi.org/10.1109/JESTPE.2023.3262344

A high voltage thyristor converter is realized by many valve sections, whose volume is approximately occupied for only the 10% by thyristors and for the 10% by the relevant gate drivers. The remaining 80% is taken by passive auxiliary circuits, neede... Read More about Development and Validation of a Smart Architecture for Thyristor Valves.

Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process (2021)
Journal Article
Dai, J., Li, J., Agyakwa, P., Corfield, M., & Johnson, C. M. (2021). Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process. IEEE Transactions on Device and Materials Reliability, 21(4), 536-543. https://doi.org/10.1109/TDMR.2021.3118323

This study investigates the power cycling reliability of nanosilver sintered joints formed by a time-reduced sintering process, designed for use on a die bonder. A range of sintering parameters, reflecting different levels of manufacturability, were... Read More about Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process.

A GaN-HEMT Compact Model Including Dynamic RDSon Effect for Power Electronics Converters (2021)
Journal Article
Li, K., Evans, P. L., Johnson, C. M., Videt, A., & Idir, N. (2021). A GaN-HEMT Compact Model Including Dynamic RDSon Effect for Power Electronics Converters. Energies, 14(8), Article 2092. https://doi.org/10.3390/en14082092

In order to model GaN-HEMT switching transients and determine power losses, a compact model including dynamic RDSon effect is proposed herein. The model includes mathematical equations to represent device static and capacitance-voltage characteristic... Read More about A GaN-HEMT Compact Model Including Dynamic RDSon Effect for Power Electronics Converters.

Multi?frequency averaging (MFA) model of a generic electric vehicle powertrain suitable under variable frequency of averaging developed for remote operability (2020)
Journal Article
Sen, S., Evans, P. L., & Johnson, C. M. (2020). Multi?frequency averaging (MFA) model of a generic electric vehicle powertrain suitable under variable frequency of averaging developed for remote operability. IET Electrical Systems in Transportation, 10(3), 268-274. https://doi.org/10.1049/iet-est.2019.0043

© The Institution of Engineering and Technology 2020. Geographically distributed hardware-in-the-loop (HIL) testing has the potential to allow hybrid vehicle powertrain components (battery, motor drive, and engine) to be developed at geographically r... Read More about Multi?frequency averaging (MFA) model of a generic electric vehicle powertrain suitable under variable frequency of averaging developed for remote operability.

Accurate Measurement of Dynamic ON-state Resistance of GaN Devices under Reverse and Forward Conduction in High Frequency Power Converter (2020)
Journal Article
Li, K., Videt, A., Idir, N., Evans, P., & Johnson, M. (2020). Accurate Measurement of Dynamic ON-state Resistance of GaN Devices under Reverse and Forward Conduction in High Frequency Power Converter. IEEE Transactions on Power Electronics, 35(9), 9652-9662. https://doi.org/10.1109/TPEL.2019.2961604

Because of trapped charges in GaN transistor structure, device dynamic ON-state resistance RDSon is increased when it is operated in high frequency switched power converters, in which device is possibly operated by zero voltage switching (ZVS) to red... Read More about Accurate Measurement of Dynamic ON-state Resistance of GaN Devices under Reverse and Forward Conduction in High Frequency Power Converter.

10-kV SiC MOSFET Power Module With Reduced Common-Mode Noise and Electric Field (2019)
Journal Article
DiMarino, C. M., Mouawad, B., Johnson, C. M., Boroyevich, D., & Burgos, R. (2020). 10-kV SiC MOSFET Power Module With Reduced Common-Mode Noise and Electric Field. IEEE Transactions on Power Electronics, 35(6), 6050-6060. https://doi.org/10.1109/tpel.2019.2952633

The advancement of silicon carbide (SiC) power devices with voltage ratings exceeding 10 kV is expected to revolutionize medium- and high-voltage systems. However, present power module packages are limiting the performance of these unique switches. T... Read More about 10-kV SiC MOSFET Power Module With Reduced Common-Mode Noise and Electric Field.

Time-efficient sintering processes to attach power devices using nanosilver dry film (2017)
Journal Article
Dai, J., Li, J., Agyakwa, P., & Mark Johnson, C. (2017). Time-efficient sintering processes to attach power devices using nanosilver dry film. Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), 2017(HiTEN), 000207–000212. https://doi.org/10.4071/2380-4491.2017.hiten.207

Pressure-assisted sintering processes to attach power devices using wet nanosilver pastes with time scales of minutes to a few hours have been widely reported. This paper presents our work on time-efficient sintering, using nanosilver dry film and an... Read More about Time-efficient sintering processes to attach power devices using nanosilver dry film.

Design Tools for Rapid Multidomain Virtual Prototyping of Power Electronic Systems (2015)
Journal Article
Evans, P. L., Castellazzi, A., & Johnson, C. M. (2016). Design Tools for Rapid Multidomain Virtual Prototyping of Power Electronic Systems. IEEE Transactions on Power Electronics, 31(3), 2443-2455. https://doi.org/10.1109/TPEL.2015.2437793

The need for multidisciplinary virtual prototyping in power electronics has been well established, however, design tools capable of facilitating a rapid iterative virtual design process do not exist. A key challenge in developing such tools is identi... Read More about Design Tools for Rapid Multidomain Virtual Prototyping of Power Electronic Systems.

Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment (2014)
Journal Article
Wang, Y., Li, J., Agyakwa, P., Johnson, C. M., & Li, S. (2014). Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment. Molecular Crystals and Liquid Crystals, 604(1), 11-26. https://doi.org/10.1080/15421406.2014.967647

© 2014 Copyright © Taylor & Francis Group, LLC. The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanoparticles at 240°C and 5 MPa for 3 to 17 minutes. Their microstructural features were quantitatively cha... Read More about Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment.

Calibration of a novel microstructural damage model for wire bonds (2014)
Journal Article
Yang, L., Agyakwa, P., & Johnson, C. (2014). Calibration of a novel microstructural damage model for wire bonds. IEEE Transactions on Device and Materials Reliability, 14(4), 989-994. https://doi.org/10.1109/TDMR.2014.2354739

In a previous paper, a new time-domain damage-based physics model was proposed for the lifetime prediction of wire bond interconnects in power electronic modules. Unlike cycle-dependent life prediction methodologies, this model innovatively incorpora... Read More about Calibration of a novel microstructural damage model for wire bonds.