All Outputs (2)

Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules (2018)
Conference Proceeding
Yang, L., Agyakwa, P., Corfield, M., Johnson, M., Harris, A., Packwood, M., & Paciura, K. (2018). Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules.

This paper characterizes thermal and reliability performance of a SiC MOSFET power module with embedded decoupling capacitors and without anti-parallel diodes. Active and passive temperature cycling, supported by transient thermal impedance character... Read More about Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules.

A thermal cycling reliability study of ultrasonically bonded copper wires (2016)
Journal Article
Arjmand, E., Agyakwa, P. A., Corfield, M. R., Li, J., Mouawad, B., & Mark Johnson, C. (2016). A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability, 59, https://doi.org/10.1016/j.microrel.2016.01.009

In this work we report on a reliability investigation regarding heavy copper wires ultrasonically bonded onto active braze copper substrates. The results obtained from both a non-destructive approach using 3D X-ray tomography and shear tests showed n... Read More about A thermal cycling reliability study of ultrasonically bonded copper wires.