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Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure (2017)
Journal Article
Zhang, H., Li, J., Dai, J., Corfield, M., Liu, X., Liu, Y., …Johnson, C. M. (2018). Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 175-187. https://doi.org/10.1109/jestpe.2017.2758901

This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in planar power modules. Finite element (FE) modeling and simulation were first used to predict... Read More about Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure.

Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior (2017)
Journal Article
Li, J., Yaqub, I., Corfield, M., & Johnson, C. M. (2017). Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 7(5), 734-744. https://doi.org/10.1109/TCPMT.2017.2683202

Insulated gate bipolar transistor (IGBT) modules, which can fail to stable short-circuit mode, have major applications in electricity network-related fields. Sn-3.5Ag solder joints and sintered Ag joints for the die attachment and Mo, Cu, Sn-3.5Ag, A... Read More about Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior.