All Outputs (16)

Packaging for fast switching power electronics (2023)
Conference Proceeding
Marchant, S., Dai, J., Mouawad, B., Empringham, L., & Clare, J. (2023). Packaging for fast switching power electronics. In 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP). https://doi.org/10.1109/SPEC56436.2023.10408379

This work investigates printed circuit board embedding of the power devices in order to support low inductance, fast switching package designs. The embedding process is discussed and a half bridge package is designed around a 500V supply voltage and... Read More about Packaging for fast switching power electronics.

A Topology-Morphing Series Resonant Converter for Photovoltaic Module Applications (2022)
Conference Proceeding
Sergentanis, G., De Lillo, L., Empringham, L., & Johnson, C. M. (2022). A Topology-Morphing Series Resonant Converter for Photovoltaic Module Applications. In 2022 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe)

Residential solar photovoltaic (PV) installations frequently use power optimizers to increase their energy production. In this application, the ability to regulate a wide range of voltage with high efficiency is highly desirable. Thus, this paper pro... Read More about A Topology-Morphing Series Resonant Converter for Photovoltaic Module Applications.

Influence of Emitter Side Design on the Unintentional Turn-on of 10kV+ SiC n-IGBTs (2022)
Conference Proceeding
Almpanis, I., Antoniou, M., Evans, P., Empringham, L., Gammon, P., Udrea, F., …Lophitis, N. (2022). Influence of Emitter Side Design on the Unintentional Turn-on of 10kV+ SiC n-IGBTs. In 2022 IEEE Energy Conversion Congress and Exposition (ECCE). https://doi.org/10.1109/ecce50734.2022.9947492

Silicon Carbide (SiC) N-channel Insulated Gate Bipolar Transistors (n-IGBTs) rated higher than 10kV can improve Medium Voltage and High Voltage power electronics due to the favourable combination of SiC material with the nIGBT device structure. This... Read More about Influence of Emitter Side Design on the Unintentional Turn-on of 10kV+ SiC n-IGBTs.

Short-Circuit Performance Investigation of 10kV+ Rated SiC n-IGBT (2022)
Conference Proceeding
Almpanis, I., Gammon, P., Mawby, P., Evans, P., Empringham, L., Lophitis, N., …Udrea, F. (2022). Short-Circuit Performance Investigation of 10kV+ Rated SiC n-IGBT. In IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA-Europe). https://doi.org/10.1109/WiPDAEurope55971.2022.9936475

This paper presents a comprehensive short-circuit robustness investigation of 4H- Silicon Carbide (SiC) n-type Insulated Gate Bipolar Transistors (nIGBTs) for Medium-Voltage and High- Voltage applications. Numerical electrothermal TCAD simulations ev... Read More about Short-Circuit Performance Investigation of 10kV+ Rated SiC n-IGBT.

A novel manufacturing technique for integrating magnetic components windings on power module substrates (2019)
Conference Proceeding
Stratta, A., Mouawad, B., Ahmadi, B., de Lillo, L., Empringham, L., & Johnson, M. (2019). A novel manufacturing technique for integrating magnetic components windings on power module substrates. https://doi.org/10.23919/EPE.2019.8914742

Single Stage Dual Active Bridge AC-DC Converter with Active Power Decoupling (2018)
Conference Proceeding
Gottardo, D., De Lillo, L., Empringham, L., Costabeber, A., & Chen, L. (2018). Single Stage Dual Active Bridge AC-DC Converter with Active Power Decoupling. In SPEEDAM 2018 - Proceedings: International Symposium on Power Electronics, Electrical Drives, Automation and Motion (497-501). https://doi.org/10.1109/SPEEDAM.2018.8445410

The paper introduces a new a isolated DC-AC DAB converter topology, capable of active power decoupling on the AC side of the transformer, made up of two full bridges with no additional active component. The differential voltage modulated by the DC-si... Read More about Single Stage Dual Active Bridge AC-DC Converter with Active Power Decoupling.

Cost effective direct-substrate jet impingement cooling concept for power application (2018)
Conference Proceeding
Mouawad, B., Abebe, R., Skuriat, R., Li, J., De Lillo, L., Empringham, L., …Haynes, G. (2018). Cost effective direct-substrate jet impingement cooling concept for power application. In PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management

Direct substrate jet impingement cooling can eliminate the use of the baseplate and significantly reduce the weight and volume of conventional thermal management solutions. This work demonstrates a cost-effective manufacturing approach based on print... Read More about Cost effective direct-substrate jet impingement cooling concept for power application.

Novel silicon carbide integrated power module for EV application (2018)
Conference Proceeding
Mouawad, B., Espina, J., Li, J., Empringham, L., & Johnson, C. M. (2018). Novel silicon carbide integrated power module for EV application. In IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia 2018), At Xi'an, Shaanxi

The successful penetration of Electric Vehicles (EVs) into the global automotive markets requires the developments of cost effective, high performance and high integration power electronic systems. The present work is concerned with the structural in... Read More about Novel silicon carbide integrated power module for EV application.

Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems (2018)
Conference Proceeding
Ahmadi, B., Espina, J., De Lillo, L., Abebe, R., Empringham, L., & Johnson, C. M. (2018). Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems.

In this paper, an innovative method of electro-thermal integration of a drive system is presented. Important challenges of this integration consist of, firstly coupled thermal design of switching power modules and PM electric motor and secondly integ... Read More about Next generation integrated drive: a novel thermal and electrical integration technique for high power density converters used in automotive drive systems.

Design and testing of electromechanical actuator for aerospace applications (2018)
Conference Proceeding
Papini, L., Connor, P., Patel, C., Empringham, L., Gerada, C., & Wheeler, P. (2018). Design and testing of electromechanical actuator for aerospace applications. In 2018 25th International Workshop on Electric Drives: Optimization in Control of Electric Drives (IWED2018) - Proceedings (1-6). https://doi.org/10.1109/IWED.2018.8321392

Electromechanical actuators are gaining interest in the aerospace industry within the More Electrical Aircraft (MEA) architecture. The end-goal of fully electric aircraft includes Electromechanical actuation for flight control systems. The design and... Read More about Design and testing of electromechanical actuator for aerospace applications.

Matrix converter open circuit fault diagnosis with asymmetric one zero SVM (2017)
Conference Proceeding
Zhang, J., Empringham, L., De Lillo, L., Dan, H., & Wheeler, P. (2017). Matrix converter open circuit fault diagnosis with asymmetric one zero SVM.

An open-circuit fault detection and diagnosis strategy for a direct matrix converter is proposed in this paper. The current recirculating path during an open circuit condition is considered in detail with the aim of contributing more expert knowledge... Read More about Matrix converter open circuit fault diagnosis with asymmetric one zero SVM.

Highly-integrated power cell for high-power wide band-gap power converters (2017)
Conference Proceeding
Espina, J., Ahmadi, B., Empringham, L., De Lillo, L., & Johnson, C. M. (2017). Highly-integrated power cell for high-power wide band-gap power converters.

The fast switching speeds and low specific conduction losses of wide band-gap semiconductors allow the realisation of high-frequency, high power-density switching converters with dramatically reduced passive component requirements compared to Silicon... Read More about Highly-integrated power cell for high-power wide band-gap power converters.

Differential buck single phase grid connected AC-DC converter with active power decoupling using a flipping Capacitor (2017)
Conference Proceeding
Gottardo, D., De Lillo, L., Empringham, L., & Costabeber, A. (2017). Differential buck single phase grid connected AC-DC converter with active power decoupling using a flipping Capacitor.

This paper introduces a new single-phase AC-DC converter capable of achieving independent voltage control across a dedicated power decoupling capacitor, by exploiting the same full bridge that controls the grid current in combination with two bidirec... Read More about Differential buck single phase grid connected AC-DC converter with active power decoupling using a flipping Capacitor.

A low capacitance single-phase AC-DC converter with inherent power ripple decoupling (2016)
Conference Proceeding
Gottardo, D., De Lillo, L., Empringham, L., & Costabeber, A. (2016). A low capacitance single-phase AC-DC converter with inherent power ripple decoupling.

This paper proposes a new single-phase AC-DC conversion topology with inherent power ripple decoupling, based on the combination of a PWM H-bridge inverter, an AC side LC filter and a ZVS line commutated H-bridge. A capacitor on the AC side is used a... Read More about A low capacitance single-phase AC-DC converter with inherent power ripple decoupling.

Experimental comparison of devices thermal cycling in direct matrix converters (DMC) and Indirect Matrix Converters (IMC) using SiC MOSFETs (2016)
Conference Proceeding
Trentin, A., Zanchetta, P., Empringham, L., De Lillo, L., Wheeler, P., & Clare, J. C. (2016). Experimental comparison of devices thermal cycling in direct matrix converters (DMC) and Indirect Matrix Converters (IMC) using SiC MOSFETs.

This paper presents an experimental comparison between a Direct Matrix Converter and an Indirect Matrix Converter in terms of semiconductor devices thermal cycling. Both converters have been designed and built using SiC MOSFETs; the Indirect Matrix C... Read More about Experimental comparison of devices thermal cycling in direct matrix converters (DMC) and Indirect Matrix Converters (IMC) using SiC MOSFETs.

Conducted emission evaluation for direct matrix converters (2016)
Conference Proceeding
Nothofer, A., Tarisciotti, L., Greedy, S., Empringham, L., De Lillo, L., & Degano, M. (2016). Conducted emission evaluation for direct matrix converters.

Matrix converters have been recently proposed as an alternative solution to the standard back-to-back converter in aerospace applications. However, Electromagnetic Interference (EMI), in particular, conducted emissions represent a critical aspect for... Read More about Conducted emission evaluation for direct matrix converters.