Research Repository

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Co-design/simulation of flip-chip assembly for high voltage IGBT packages (2017)
Conference Proceeding
Rajaguru, P., Bailey, C., Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., …Elliot, A. (2017). Co-design/simulation of flip-chip assembly for high voltage IGBT packages

This paper details a co-design and modelling methodology to optimise the flip-chip assembly parameters so that the overall package and system meets performance and reliability specifications for LED lighting applications. A co-design methodology is e... Read More

Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers (2017)
Conference Proceeding
Aliyu, A. M., Mouawad, B., Castellazzi, A., Rajaguru, P., Bailey, C., Pathirana, V., …Udrea, F. (in press). Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers

This paper presents a novel chip on board assembly design for an integrated power switch, based on high power density 800V silicon lateral insulated-gate bipolar transistor (Si LIGBT) technology. LIGBTs offer much higher current densities (5-10X), si... Read More

Measuring structure functions of power devices in inverters (2017)
Journal Article
Aliyu, A. M., & Castellazzi, A. (in press). Measuring structure functions of power devices in inverters. Microelectronics Reliability, doi:10.1016/j.microrel.2017.03.036. ISSN 0026-2714

This paper proposes the measuring of structure function from power devices on-board induction motor drives and multilevel converters. It puts forward the issues and methodology related to on-board measurement of the cooling curve and derivation of th... Read More

Evaluation of SiC Schottky diodes using pressure contacts (2017)
Journal Article
Ortiz Gonzalez, J., Alatise, O., Aliyu, A. M., Rajaguru, P., Castellazzi, A., Ran, L., …Bailey, C. (2017). Evaluation of SiC Schottky diodes using pressure contacts. IEEE Transactions on Industrial Electronics, 64(10), doi:10.1109/TIE.2017.2677348. ISSN 0278-0046

The thermomechanical reliability of SiC power devices and modules is increasingly becoming of interest especially for high power applications where power cycling performance is critical. Press-pack assemblies are a trusted and reliable packaging solu... Read More

Prognostic System for Power Modules in Converter Systems Using Structure Function (2017)
Journal Article
Aliyu, A. M., & Castellazzi, A. (2018). Prognostic System for Power Modules in Converter Systems Using Structure Function. IEEE Transactions on Power Electronics, 33(1), doi:10.1109/TPEL.2017.2672823. ISSN 0885-8993

This paper proposes an on-board methodology for monitoring the health of power converter modules in drive systems, using vector control heating and structure function to check for degradation. It puts forward a system that is used on-board to measure... Read More