Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter

Arshad, Adeel; Ali, Hafiz Muhammad; Khushnood, Shahab; Jabbal, Mark

Abstract

This experimental study presents the parametric analysis for the round pin-finned heat sinks subjected to steady heat densities for effective and reliable cooling of mobile electronic devices. Phase change material (PCM) namely paraffin wax is adopted as energy storage material and aluminum made round pin-fins are selected as thermal conductivity enhancers (TCEs). A constant volume fraction of 9% of round pin-fins is selected with pin diameter of 2

Citation

Arshad, A., Ali, H. M., Khushnood, S., & Jabbal, M. (in press). Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: effect of pin-fin diameter. International Journal of Heat and Mass Transfer, 117, https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.008

• Journal Article Type: Article
• Acceptance Date: Oct 2, 2017
• Online Publication Date: Oct 21, 2017
• Deposit Date: Oct 18, 2017
• Publicly Available Date: Oct 22, 2018
• Journal: International Journal of Heat and Mass Transfer
• Print ISSN: 0017-9310
• Electronic ISSN: 0017-9310
• Publisher: Elsevier
• Peer Reviewed: Peer Reviewed
• Volume: 117
• DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.008
• Keywords: Round pin-fin; Heat Sink; Phase Change Material; Thermal Conductivity Enhancers; Paraffin Wax; set point temperatures; Enhancement Ratio; Heat capacity; Thermal Conductance
• Public URL: https://nottingham-repository.worktribe.com/output/888681
• Publisher URL: http://www.sciencedirect.com/science/article/pii/S0017931017328107