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Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch

Cova, P.; Aliyu, Attahir Murtala; Castellazzi, Alberto; Chiozzi, D.; Delmonte, N.; Lasserre, P.; Pignoloni, N.

Authors

P. Cova

Attahir Murtala Aliyu

Alberto Castellazzi

D. Chiozzi

N. Delmonte

P. Lasserre

N. Pignoloni



Abstract

The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 V–35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization.

Citation

Cova, P., Aliyu, A. M., Castellazzi, A., Chiozzi, D., Delmonte, N., Lasserre, P., & Pignoloni, N. (in press). Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch. Microelectronics Reliability, 76-77, https://doi.org/10.1016/j.microrel.2017.06.062

Journal Article Type Article
Acceptance Date Jun 26, 2017
Online Publication Date Jul 8, 2017
Deposit Date Jul 17, 2017
Publicly Available Date Jul 17, 2017
Journal Microelectronics Reliability
Print ISSN 0026-2714
Electronic ISSN 0026-2714
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 76-77
DOI https://doi.org/10.1016/j.microrel.2017.06.062
Keywords High power density; Packaging; System integration; Thermal design; Liquid cooling
Public URL http://eprints.nottingham.ac.uk/id/eprint/44221
Publisher URL http://www.sciencedirect.com/science/article/pii/S0026271417302500?via%3Dihub
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0





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