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Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch

Cova, P.; Aliyu, Attahir Murtala; Castellazzi, Alberto; Chiozzi, D.; Delmonte, N.; Lasserre, P.; Pignoloni, N.

Authors

P. Cova

Attahir Murtala Aliyu

Alberto Castellazzi

D. Chiozzi

N. Delmonte

P. Lasserre

N. Pignoloni



Abstract

The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 V–35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization.

Journal Article Type Article
Journal Microelectronics Reliability
Print ISSN 0026-2714
Electronic ISSN 0026-2714
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 76-77
APA6 Citation Cova, P., Aliyu, A. M., Castellazzi, A., Chiozzi, D., Delmonte, N., Lasserre, P., & Pignoloni, N. (in press). Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch. Microelectronics Reliability, 76-77, doi:10.1016/j.microrel.2017.06.062
DOI https://doi.org/10.1016/j.microrel.2017.06.062
Keywords High power density; Packaging; System integration; Thermal design; Liquid cooling
Publisher URL http://www.sciencedirect.com/science/article/pii/S0026271417302500?via%3Dihub
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by-nc-nd/4.0





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