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Design and construction of a co-planar power bus interconnect for low inductance switching

Lin, Xi; Li, Jianfeng; Johnson, Mark

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Authors

Xi Lin

Jianfeng Li

MARK JOHNSON MARK.JOHNSON@NOTTINGHAM.AC.UK
Professor of Advanced Power Conversion



Abstract

A co-planar tab-slot type of interconnect demonstrator for connecting power switching devices and DC bus capacitors has been designed and constructed, aimed at low inductance switching. The demonstrator is composed of a double-sided tab connector and a dual polarity slot. This type of interconnect eliminates the use of screw terminal connection between a power module and the DC bus as well as between the DC bus and power capacitors, thus serves to maintain a coplanar current profile throughout the power distribution path. Parasitic analysis both in impedance testing and in Finite Element simulation suggests that the inductance in the bus loop of the demonstrator is approximately half of that achieved in an equally dimensioned busbar with conventional screw terminals.

Citation

Lin, X., Li, J., & Johnson, M. (2017). Design and construction of a co-planar power bus interconnect for low inductance switching. In 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) (1-4). https://doi.org/10.1109/IWIPP.2017.7936755

Conference Name 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)
Conference Location Delft, Netherlands
Start Date Apr 5, 2017
End Date Apr 7, 2017
Acceptance Date Jan 19, 2017
Online Publication Date Jun 1, 2017
Publication Date 2017
Deposit Date Aug 7, 2017
Publicly Available Date Mar 29, 2024
Peer Reviewed Peer Reviewed
Pages 1-4
Book Title 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)
ISBN 978-1-5090-4279-1
DOI https://doi.org/10.1109/IWIPP.2017.7936755
Keywords Inductance, Multichip modules, Conductors, Plastics, Connectors
Public URL https://nottingham-repository.worktribe.com/output/854937
Publisher URL https://doi.org/10.1109/IWIPP.2017.7936755
Additional Information © 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

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