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The interplay of crack hopping, delamination and interface failure in drying nanoparticle films

Yang, Bin; Sharp, James S.; Smith, Mike I.

Authors

Bin Yang



Abstract

Films formed through the drying of nanoparticle suspensions release the build-up of strain through a variety of different mechanisms including shear banding, crack formation and delamination. Here we show that important connections exist between these different phenomena: delamination depends on the dynamics of crack hopping, which in turn is influenced by the presence of shear bands. We also show that delamination does not occur uniformly across the film. As cracks hop they locally initiate the delamination of the film which warps with a timescale much longer than that associated with the hopping of cracks. The motion of a small region of the delamination front, where the shear component of interfacial crack propagation is believed to be enhanced, results in the deposition of a complex zig-zag pattern on the supporting substrate.

Journal Article Type Article
Publication Date Aug 25, 2016
Journal Scientific Reports
Print ISSN 2045-2322
Electronic ISSN 2045-2322
Publisher Nature Publishing Group
Peer Reviewed Peer Reviewed
Volume 6
Issue 1
Article Number e32296
Pages 1-9
APA6 Citation Yang, B., Sharp, J. S., & Smith, M. I. (2016). The interplay of crack hopping, delamination and interface failure in drying nanoparticle films. Scientific Reports, 6(1), 1-9. https://doi.org/10.1038/srep32296
DOI https://doi.org/10.1038/srep32296
Publisher URL http://www.nature.com/articles/srep32296
Copyright Statement Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0

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Copyright Statement
Copyright information regarding this work can be found at the following address: http://creativecommons.org/licenses/by/4.0





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