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Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30K

Agyakwa, Pearl; Yang, Li; Arjmand, Elahjeh; Evans, Paul; Corfield, Martin; Johnson, Christopher Mark

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Authors

PEARL AGYAKWA PEARL.AGYAKWA@NOTTINGHAM.AC.UK
Anne Mclaren Research Fellow

Li Yang

Elahjeh Arjmand

PAUL EVANS paul.evans@nottingham.ac.uk
Associate Professor

Martin Corfield

MARK JOHNSON MARK.JOHNSON@NOTTINGHAM.AC.UK
Professor of Advanced Power Conversion



Abstract

© 2016, The Author(s). Ultrasonically bonded heavy Al wires subjected to a small junction temperature fluctuation under power cycling from 40°C to 70°C were investigated using a non-destructive three-dimensional (3-D) x-ray tomography evaluation approach. The occurrence of irreversible deformation of the microstructure and wear-out under such conditions were demonstrated. The observed microstructures consist of interfacial and inter-granular cracks concentrated in zones of stress intensity, i.e., near heels and emanating from interface precracks. Interfacial voids were also observed within the bond interior. Degradation rates of ‘first’ and ‘stitch’ bonds are compared and contrasted. A correlative microscopy study combining perspectives from optical microscopy with the x-ray tomography results clarifies the damage observed. An estimation of lifetime is made from the results and discussed in the light of existing predictions.

Citation

Agyakwa, P., Yang, L., Arjmand, E., Evans, P., Corfield, M., & Johnson, C. M. (2016). Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30K. Journal of Electronic Materials, 45, 3659-3672. https://doi.org/10.1007/s11664-016-4519-0

Journal Article Type Article
Acceptance Date Apr 6, 2016
Online Publication Date Apr 20, 2016
Publication Date 2016-07
Deposit Date May 17, 2016
Publicly Available Date Mar 28, 2024
Journal Journal of Electronic Materials
Print ISSN 0361-5235
Electronic ISSN 1543-186X
Publisher Springer Verlag
Peer Reviewed Peer Reviewed
Volume 45
Pages 3659-3672
DOI https://doi.org/10.1007/s11664-016-4519-0
Keywords Aluminum, wire bonds, power cycling, reliability, x-ray tomography, high cycle thermal fatigue
Public URL https://nottingham-repository.worktribe.com/output/784353
Publisher URL http://link.springer.com/article/10.1007%2Fs11664-016-4519-0

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