Liquid Metal Enabled SIW Vias and RF Blocking Walls for Reconfigurable Antennas

Alkaraki, Shaker; Qu, Zhishu; Kelly, James; Borja, Alejandro L.; Mittra, Raj; Wang, Yi

Abstract

This paper presents a method for designing reconfigurable microwave devices based on substrate integrated waveguides (SIW) technology. The method involves forming walls from drill holes that can be filled with liquid metal to form vias. Furthermore, the proposed method is validated by designing and testing several reconfigurable radio frequency (RF) switches. The switches are intended to be used for reconfigurable antenna applications. The measured results for the proposed devices are in good agreement with the simulated results and they show wideband operating bandwidth with highly efficient performance. The proposed method will find application within a wide range of different reconfigurable microwave devices and circuits.

Citation

Alkaraki, S., Qu, Z., Kelly, J., Borja, A. L., Mittra, R., & Wang, Y. (2022, March). Liquid Metal Enabled SIW Vias and RF Blocking Walls for Reconfigurable Antennas. Presented at 2022 16th European Conference on Antennas and Propagation (EuCAP), Madrid, Spain

• Presentation Conference Type: Edited Proceedings
• Conference Name: 2022 16th European Conference on Antennas and Propagation (EuCAP)
• Start Date: Mar 27, 2022
• End Date: Apr 1, 2022
• Acceptance Date: Mar 27, 2022
• Online Publication Date: May 11, 2022
• Publication Date: Mar 27, 2022
• Deposit Date: Sep 26, 2023
• Publisher: Institute of Electrical and Electronics Engineers
• Pages: 1-5
• Book Title: 2022 16th European Conference on Antennas and Propagation (EuCAP)
• ISBN: 9781665416047
• DOI: https://doi.org/10.23919/eucap53622.2022.9769614
• Public URL: https://nottingham-repository.worktribe.com/output/25077242
• Publisher URL: https://ieeexplore.ieee.org/document/9769614