Skip to main content

Research Repository

Advanced Search

Device-package interaction and gate driver layout analysis in SiC MOSFET power modules for more electric aircraft motor drive applications

O'Donnell, Shane; Egan, Laurence; Walsh, Vincent; Wheeler, Pat; Castellazzi, Alberto

Authors

Shane O'Donnell

Laurence Egan

Vincent Walsh

Alberto Castellazzi



Abstract

This paper presents measurements and comparison analysis of 1200 V SiC MOSFET gate drive signals in two different integrated power solutions designed for More Electric Aircraft motor drive applications. The modules are designed to accommodate a 540 V high voltage DC bus and have a maximum output phase current of 25 A peak. Both modules comprise of typical three-phase inverter bridge configurations, with 40 m? MOSFETs and 20 A anti-parallel diodes. However, their gate drivers, printed circuit board layouts and substrate designs are different and the effect these elements have on the performance is presented. The results illustrate that gate resistances, package interactions and PCB layout can have a major effect on performance while variations in switching frequency, from 10 kHz to 50 kHz, and a reduction in dead-time, from 500 ns to 375 ns, have negligible impacts.

Citation

O'Donnell, S., Egan, L., Walsh, V., Wheeler, P., & Castellazzi, A. (2018). Device-package interaction and gate driver layout analysis in SiC MOSFET power modules for more electric aircraft motor drive applications. In EPE'18 ECCE Europe - 20th European Conference on Power Electronics and Applications

Conference Name EPE'18 ECCE Europe - 20th European Conference on Power Electronics and Applications
Start Date Sep 17, 2018
End Date Sep 21, 2018
Acceptance Date Jul 17, 2018
Online Publication Date Sep 17, 2018
Publication Date Sep 17, 2018
Deposit Date Feb 19, 2019
Publicly Available Date Feb 19, 2019
Book Title EPE'18 ECCE Europe - 20th European Conference on Power Electronics and Applications
Public URL https://nottingham-repository.worktribe.com/output/1567171

Files

Device-package Interaction And Gate Driver Layout Analysis In SiC MOSFET Power Modules For More Electric Aircraft Motor Drive Applications (1.9 Mb)
PDF



You might also like



Downloadable Citations