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Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser with millisecond pulse widths (2018)
Journal Article
Maclean, J. O., Tangkijcharoenchai, C., Coomber, S., & Voisey, K. T. (2018). Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser with millisecond pulse widths. Procedia CIRP, 74, 407-412. https://doi.org/10.1016/j.procir.2018.08.158

The laser micro-drilling of “thru” holes, also known as via holes, in Si, InP and InSb semiconductor wafers was studied using millisecond pulse lengths from an IPG Laser Model YLR-2000 CW multimode 2 kW Ytterbium Fibre Laser and a JK400 (400 W) fibre... Read More about Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser with millisecond pulse widths.

Laser drilling of microholes in single crystal silicon using continuous wave (CW) 1070 nm fiber lasers with millisecond pulse widths (2018)
Journal Article
Maclean, J. O., Hodson, J., Tangkijcharoenchai, C., Al-Ojaili, S., Rodsavas, S., Coomber, S., & Voisey, K. (2018). Laser drilling of microholes in single crystal silicon using continuous wave (CW) 1070 nm fiber lasers with millisecond pulse widths. Lasers in Engineering, 39(1-2),

The laser microdrilling of via holes in Si semiconductor wafers was studied using 1 ms pulses from an Yb fibre laser with 1070 nm wavelength. Optical microscopy and cross‑sectional analysis were used to quantify hole dimensions, the distribution of r... Read More about Laser drilling of microholes in single crystal silicon using continuous wave (CW) 1070 nm fiber lasers with millisecond pulse widths.

Laser drilling of via micro-holes in single-crystal semiconductor substrates using a 1070nm fibre laser with millisecond pulse widths (2015)
Journal Article
Maclean, J. O., Hodson, J. R., & Voisey, K. T. (2015). Laser drilling of via micro-holes in single-crystal semiconductor substrates using a 1070nm fibre laser with millisecond pulse widths. Proceedings of SPIE, 9657, Article 965704. https://doi.org/10.1117/12.2175898

© 2015 SPIE. Micro-machining of semiconductors is relevant to fabrication challenges within the semiconductor industry. For via holes for solar cells, laser drilling potentially avoids deep plasma etching which requires sophisticated equipment and co... Read More about Laser drilling of via micro-holes in single-crystal semiconductor substrates using a 1070nm fibre laser with millisecond pulse widths.