Enhanced heat transfer of PCM-based heat sink augmented with plate-fins and hybrid nanoparticles for electronics cooling
(2025)
Journal Article
Arshad, A., Jabbal, M., & Yan, Y. (2025). Enhanced heat transfer of PCM-based heat sink augmented with plate-fins and hybrid nanoparticles for electronics cooling. International Journal of Thermal Sciences, 218, Article 110107. https://doi.org/10.1016/j.ijthermalsci.2025.110107
Passive cooling technologies based on phase change material (PCM) reveal as emerging technique for thermal management of electronic components effciently. Therefore, the current study explores the combined effect of hybrid nanoparticles (HNPs), plate... Read More about Enhanced heat transfer of PCM-based heat sink augmented with plate-fins and hybrid nanoparticles for electronics cooling.